Materials

courtesy of NORDSON Asymtek

Is it Time for Fluxless Processes for 3D Packaging?

A 3D InCites reader recently inquired whether cost drivers and fine-pitch requirements in 3D applications are moving manufacturers away from flux towards fluxless processes in the bumping steps for both bump formation and assembly.To answer this question, 3D InCites turned to the materials and equipment experts, speaking with Jeff Calvert,...

Dynaloy: A Formula for Cleans

It’s hard to believe that inside such a non-descript building set back down a picturesque country lane in (almost) rural Indiana, really cool things are happening. This is the home of Dynaloy, LLC, a subsidiary of Eastman Chemical Company, where innovative chemical formulations are being developed to remove the most...

Understanding The Complexity of Cleans

There is nothing like a little hands-on experience to help someone understand a particular technology better and more fully. Last week I spent two days in Indianapolis learning about how cleaning formulations are made, at the invitation of Steve Dwyer, Business Director Electronic Materials Dynaloy LLC, A subsidiary of Eastman...

wet etch

SSEC’s New Chemistry for TSV Reveal

This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. SSEC had a lot to celebrate at this year’s SEMICON West, 2013. The company launched two new equipment platforms, WaferStorm and WaferEtch, each configuring single wet wafer processes for specific applications. Two of...

Figure 1: Electrografting provides a very strong adhesion between organics and any surface

Alchimer Streamlines Wet Approach

Streamlined and versatile: that’s the impression I came away with after talking to Nao Shoda, senior director of business development and technology, Alchimer, about recent developments to further optimize the companies’ electrografting processes for through silicon via (TSV), isolation, barrier, seed and fill steps. I wrote about them frequently in...