Things are humming along at EV Group
“Keeping busy” doesn’t begin to describe what’s happening at EV Group these days. I sat down with Markus Wimplinger, Corporate Technology Development and IP Director, EVG, at SEMICON West for a full briefing of the company’s latest corporate and technology developments. Remaining true to their mission of “invent, innovate, implement”...Alchimer Discloses Major TSV Barrier Film Advance
A new film-deposition technology advance from Alchimer S.A.is said to cut fill deposition times and could provide new options for the electronics packaging industry as it struggles to bring through-silicon vias (TSVs) into cost-effective production. Alchimer has disclosed that its AquiVia TSV barrier-layer process has the ability to provide uniform,...EV Group Boosts High-Volume Manufacturing Performance Across Product Lines With New XT Frame Equipment Platform
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has introduced a new equipment platform, dubbed the XT Frame, that extends process throughput and tool functionality for virtually all of its current volume-manufacturing product offerings. Specifically designed...CEA-Leti to Implement Multiple EV Group Systems on its New 300-mm Fab Line Dedicated to 3D Integration
St. Florian, Austria, April 19, 2011 – EV Group (EVG) today announced that its longtime customer and partner, industry-leading research center CEA-Leti (Grenoble, France), has installed multiple EVG tools in its industry-first 300-mm cleanroom dedicated to R&D and prototyping for 3D-integration applications. While Leti’s new state-of-the-art facility is focused on...STATS ChipPAC Expands TSV with Mid-End Processing
STATS ChipPAC Ltd, and outsourced semiconductor assembly and test (OSAT) provider, announced it is expanding its 300mm through silicon via (TSV) offering with the addition of mid-end manufacturing capabilities. STATS ChipPAC was one of the first OSATS to invest in TSV technology with a 51,000 square foot research and development...Going UP! Next-Generation IC Assembly
Coverage of the GSA Memory Conference continues in this week's issue of Chip Scale Review Tech Monthly. Francoise von Trapp contributed this article. While there continue to be incremental improvements and innovations in single chip packaging technologies, it’s nothing compared to the focus on multi-chip assembly and packaging technologies. Whether...Exploring New Approaches to 3D Integration
In this article that appeared in the April Issue of CSR Tech Monthly, Andrew Smith, Ron Csermak, and Mark Vandermeulen of ON Semiconductor discuss the company's novel approach to 3D integration without TSV interconnects. Designers seeking electronic package miniaturization but lacking the resources to utilize custom ASIC or complex 3D...C2W Bonding Approaches: Variations on Theme
As chip-to-wafer (C2W) stacking has been identified by most technologists as the best approach to 3D stacking for optimum yields and the ability to stack dies of different sizes — especially in memory/logic stacks — a number of approaches have been or are being developed by various collaboratives. At IMAPS...Invensas and ALLVIA Collaboration Results in Full 3D R&D Line; Paves the Way for 3D Manufacturing
Earlier this week Invensas Corporation, a wholly-owned subsidiary of Tessera Technologies, Inc., announced both its acquisition of ALLVIA’s patent assets, and a two-year collaborative partnership with ALLVIA to further develop technology and intellectual property (IP) in the 3-dimensional integrated circuit (3D-IC) packaging space. This strategic alliance is expected to optimize...Rudolph Fulfills Multiple System Orders for TSV Inspection and Metrology
Rudolph Technologies, Inc., provider of process characterization equipment and software for the semiconductor, solar and LED industries, announced today that it has shipped its Wafer Scanner™ 3880 3D Inspection System, multiple NSX® Macro Defect Inspection Systems and its Discover® Yield Management Software Suite to a leading semiconductor manufacturer for use...SPTS Ships APS Etch System To Fraunhofer ISIT
SPP Process Technology Systems (SPTS) has shipped an APS etch system to Fraunhofer ISIT (FhG-ISIT). The system will add new process capability to ISIT’s MEMS manufacturing line to fuel next-generation development of devices such as actuators, sensors and energy harvesters. “We have chosen to add APS to extend our offerings...3D: You’ve Come a Long Way Baby!
This column by Francoise von Trapp appeared in the Jan/Feb 2011 issue of Chip Scale Review It sums up a lot of what was said at various 3D IC events over the past few months. A year ago, there were still skeptics in the room at the annual 3D Architectures...CEA-Leti Ramps up 300mm Line Dedicated to 3D-Integration Applications
Grenoble-based research institute, CEA-Leti, will significantly expand its technology offering this month when it ramps up one of Europe’s first 300mm lines dedicated to 3D-integration applications.By adding this technology to its existing 300mm CMOS R&D line, Leti now can offer heterogeneous integration technologies to customers on both 200mm and 300mm...EV Group Introduces Industry’s First Fully Automated Wafer Bonding System for HB-LED Manufacturing
EVG560HBL Significantly Increases Throughput for Volume HB-LED Production
