Manufacturing

TAMAR TECHNOLOGY RECEIVES ORDER FOR WAFERSCAN SYSTEM FOR 3DIC PACKAGING

NEWBURY PARK, CALIF.--Tamar Technology received an order for its WaferScan metrology system from a major semiconductor manufacturer. The system will be used for 3DIC packaging and process development. Tamar’s WaferScan system provides high-speed non-destructive metrology for 3DIC advanced packaging processes being developed for high volume manufacturing (HVM). The system has...

Update on 3D transistors (That “other” 3D)

I always hesitate to cove 3D transistors, because before they came along, I only focused on what I knew to be 3D – ie: 3D stacked packages, 2.5D interposers and 3D ICs. And that was confusing enough. But then along came Intel’s Tri-Gate technology, claiming the 3D moniker as its...

STATS ChipPAC Advances TSV Capabilities; Qualifies 300mm MEOL and Low Volume Manufacturing

Outsourced Semiconductor Assembly and Test (OSAT) provider, STATS ChipPAC Ltd., has announced qualification of its 300mm middle-end-of-line (MEOL) manufacturing operation for Through Silicon Via (TSV) capabilities, and will transition to low volume manufacturing.  STATS ChipPAC says it is firmly engaged with multiple strategic customers on TSV development programs that support the...

An Incomplete List of 3D Solutions

We read a lot about the remaining challenges to be addressed before 3D ICs are fully commercialized. Current roadmaps are now targeting 2015 for commercialization of 3D ICs, while 2.5D gets the ball rolling towards the end of 2012, beginning of 2013. Reports from Xilinx indicate they are shipping 2.5D...

3D Company Updates

There are a couple of notable updates circulating this week involving companies in the 3D space. The first I saw was news from Sony that it has introduced its next-generation CMOS Image sensor they claim is “ the industry's smallest, CMOS image sensor and camera system”. The image sensor is...

A Smorgasbord of 3D News

Sometimes there’s just a bunch of random stuff that catches my eye over the course of a week, and I set it aside until it gels into something that can be crafted into a topical curated piece. This is not one of those times.  What we have here is a...

Himax Technologies Selects EV Group to Expand Production Capacity for Wafer-Level Optics

Repeat Order for IQ Aligner Further Solidifies EVG’s Position as Leading Microlens Molding Solutions Provider for Wafer-level Camera Applications  St. Florian, AUSTRIA, March 27, 2012 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Himax Technologies,...

Mitsubishi Throws its Hat in the 300mm Wafer Bonding Ring

Earlier this week, Mitsubishi Heavy Industries, Ltd. announced it had “developed the world's first fully automated 12-inch (300 millimeters) wafer bonding machine, capable of producing 3-dimensionally integrated LSI (large-scale integration) circuits at room temperature.” This tool is targeted to the MEMS, 3D LSI's, and the RF market. I was skeptical...

SEMATECH to conduct rigorous manufacturability assessments to enable high volume manufacturing readiness of 3D technology

To enable high-volume production readiness of 3D-based products, SEMATECH’s 3D Interconnect and Manufacturability programs will be conducting Equipment Maturity Assessments (EMAs) of several critical 3D tools during 2012 to establish functional equipment capabilities and address high volume manufacturing maturity issues. The assessment is a cooperative effort among experts from SEMATECH’s...

Altatech Semiconductor’s 300 mm CVD System Being Used in 3D IC Pilot Production at ASSID

All Silicon System Integration Dresden (ASSID), a leading-edge microelectronic wafer-level packaging and system integration center operated by the Fraunhofer IZM Institute, has begun pilot-line production of 3D semiconductor devices using a single-wafer, multi-chamber AltaCVD 300 system from Altatech Semiconductor S.A. At Fraunhofer IZM-ASSID’s 970-square-meter cleanroom facility in Dresden, Altatech’s

SPTS Wins New 300mm PVD Order from CEA-Leti

SPP Process Technology Systems (SPTS), has received a follow on purchase order from CEA-Leti for its Sigma® fxPTM Physical Vapor Deposition (PVD) system. The 300mm system will be used for advanced Through-Silicon-Via (TSV) development at Leti’s newly-inaugurated 300mm fab extension in Grenoble, France. This system win comes on the heels...

Shanghai Simgui Technology Places Follow-on Order for EVG Wafer Bonder; Advances to Fully Automated SOI Wafer Production

ST. FLORIAN, Austria, November 8, 2011 — EV Group (EVG) , a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Shanghai Simgui Technology Co., Ltd. (Simgui), a leading Chinese wafer manufacturer, has placed a follow-on order for an EVG850 automated production...

3D Integration in Power Devices hits High Volume

When we talk about 3D integration, we’re generally talking about 3D ICs driven by mobile market performance needs. But in the power semiconductor market, computing application performance needs are also spiking due to the increase of content like broadband mobile video and 4G communications. At the same time, telecommunications and...

Things are humming along at EV Group

“Keeping busy” doesn’t begin to describe what’s happening at EV Group these days. I sat down with Markus Wimplinger, Corporate Technology Development and IP Director, EVG,  at SEMICON West for a full briefing of the company’s latest corporate and technology developments.  Remaining true to their mission of “invent, innovate, implement”...