Oct 02, 2012 · By Francoise von Trapp · 3D In-Depth
NEWBURY PARK, CALIF.--Tamar Technology received an order for its WaferScan metrology system from a major semiconductor manufacturer. The system will be used for 3DIC packaging and process development. Tamar’s WaferScan system provides high-speed non-destructive metrology for 3DIC advanced packaging processes being developed for high volume manufacturing (HVM). The system has...Sep 20, 2012 · By Francoise von Trapp · 3D In-Depth
I always hesitate to cove 3D transistors, because before they came along, I only focused on what I knew to be 3D – ie: 3D stacked packages, 2.5D interposers and 3D ICs. And that was confusing enough. But then along came Intel’s Tri-Gate technology, claiming the 3D moniker as its...Sep 01, 2012 · By Francoise von Trapp · 3D In-Depth
STATS ChipPAC Ltd., semiconductor test and advanced packaging service provider, today held the groundbreaking ceremony for a new factory in Singapore. The new 197,000 square foot building will be located next to the Company’s current factory in Yishun, Singapore and will enable STATS ChipPAC to expand its manufacturing capabilities for...Aug 28, 2012 · By Francoise von Trapp · 3D In-Depth
Outsourced Semiconductor Assembly and Test (OSAT) provider, STATS ChipPAC Ltd., has announced qualification of its 300mm middle-end-of-line (MEOL) manufacturing operation for Through Silicon Via (TSV) capabilities, and will transition to low volume manufacturing. STATS ChipPAC says it is firmly engaged with multiple strategic customers on TSV development programs that support the...Aug 14, 2012 · By Francoise von Trapp · 3D In-Depth
I’ve come across a few interesting announcements in the 3D space today that separately are just random bits of news, but when bundled together, demonstrate acceleration to 3D commercialization. When you think about it, we’re more than halfway to Q1 2013, which has been earmarked by Micron as when 2...Jul 14, 2012 · By Francoise von Trapp · 3D Event Coverage
We read a lot about the remaining challenges to be addressed before 3D ICs are fully commercialized. Current roadmaps are now targeting 2015 for commercialization of 3D ICs, while 2.5D gets the ball rolling towards the end of 2012, beginning of 2013. Reports from Xilinx indicate they are shipping 2.5D...May 22, 2012 · By Francoise von Trapp · 3D In-Depth
We’ve all heard it: Wide I/O DRAM on Logic using TSV interconnects will be THE solution for achieving the high performance/low power needs of next generation devices, beginning with the high performance computing and making its way into gaming processors, smartphones and tablets. To listen to the experts, meeting such...May 12, 2012 · By Francoise von Trapp · Design
There are a couple of notable updates circulating this week involving companies in the 3D space. The first I saw was news from Sony that it has introduced its next-generation CMOS Image sensor they claim is “ the industry's smallest, CMOS image sensor and camera system”. The image sensor is...Apr 10, 2012 · By Francoise von Trapp · 3D In-Depth
Sometimes there’s just a bunch of random stuff that catches my eye over the course of a week, and I set it aside until it gels into something that can be crafted into a topical curated piece. This is not one of those times. What we have here is a...Mar 27, 2012 · By Francoise von Trapp · 3D In-Depth
Repeat Order for IQ Aligner Further Solidifies EVG’s Position as Leading Microlens Molding Solutions Provider for Wafer-level Camera Applications St. Florian, AUSTRIA, March 27, 2012 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Himax Technologies,...Mar 20, 2012 · By Francoise von Trapp · 3D In-Depth
There has been enough interest stirred up in R&D around glass as a low-cost alternative interposer substrate material compared with silicon, that there was an entire session dedicated to developments in that area at the 2012 IMAPS International Device Packaging conference, held March 5-8 in Scottsdale, AZ. Rao Tummala, of...Jan 18, 2012 · By Francoise von Trapp · 3D In-Depth
Earlier this week, Mitsubishi Heavy Industries, Ltd. announced it had “developed the world's first fully automated 12-inch (300 millimeters) wafer bonding machine, capable of producing 3-dimensionally integrated LSI (large-scale integration) circuits at room temperature.” This tool is targeted to the MEMS, 3D LSI's, and the RF market. I was skeptical...Jan 16, 2012 · By Francoise von Trapp · 3D In-Depth
To enable high-volume production readiness of 3D-based products, SEMATECH’s 3D Interconnect and Manufacturability programs will be conducting Equipment Maturity Assessments (EMAs) of several critical 3D tools during 2012 to establish functional equipment capabilities and address high volume manufacturing maturity issues. The assessment is a cooperative effort among experts from SEMATECH’s...Nov 10, 2011 · By Francoise von Trapp · 3D In-Depth
All Silicon System Integration Dresden (ASSID), a leading-edge microelectronic wafer-level packaging and system integration center operated by the Fraunhofer IZM Institute, has begun pilot-line production of 3D semiconductor devices using a single-wafer, multi-chamber AltaCVD 300 system from Altatech Semiconductor S.A. At Fraunhofer IZM-ASSID’s 970-square-meter cleanroom facility in Dresden, Altatech’sOct 13, 2011 · By Francoise von Trapp · 3D In-Depth
To listen to John Lau, of ITRI, speak on the topic of 3D integration is to experience a passion for technology that rivals no other; except perhaps that of Rao Tummala of Georgia Tech. But John is definitely more vocal in his passion. Rao has a softer, gentler approach. At...Sep 02, 2011 · By Francoise von Trapp · 3D In-Depth
SPP Process Technology Systems (SPTS), has received a follow on purchase order from CEA-Leti for its Sigma® fxPTM Physical Vapor Deposition (PVD) system. The 300mm system will be used for advanced Through-Silicon-Via (TSV) development at Leti’s newly-inaugurated 300mm fab extension in Grenoble, France. This system win comes on the heels...Aug 22, 2011 · By Francoise von Trapp · 3D In-Depth
At SEMICON West 2011, Prof. Rao Tummala of Georgia Tech presented the unique glass and silicon-based 3D Interposer technologies being developed at Georgia Tech, claimed to be simpler and cheaper than 3D ICs with TSV for many mobile and consumer applications at SemiconWest 2011. in his presentation, Tummala discussed the...Aug 11, 2011 · By Francoise von Trapp · 3D In-Depth
ST. FLORIAN, Austria, November 8, 2011 — EV Group (EVG) , a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Shanghai Simgui Technology Co., Ltd. (Simgui), a leading Chinese wafer manufacturer, has placed a follow-on order for an EVG850 automated production...Jul 29, 2011 · By Francoise von Trapp · 3D In-Depth
When we talk about 3D integration, we’re generally talking about 3D ICs driven by mobile market performance needs. But in the power semiconductor market, computing application performance needs are also spiking due to the increase of content like broadband mobile video and 4G communications. At the same time, telecommunications and...Jul 27, 2011 · By Francoise von Trapp · 3D In-Depth
“Keeping busy” doesn’t begin to describe what’s happening at EV Group these days. I sat down with Markus Wimplinger, Corporate Technology Development and IP Director, EVG, at SEMICON West for a full briefing of the company’s latest corporate and technology developments. Remaining true to their mission of “invent, innovate, implement”...