Manufacturing

Automatic Wafer Metrology: Applying X-ray Technology in the 3D Space
xm8000 nt1000 P1030385 XM8000 prototype

Automatic Wafer Metrology: Applying X-ray Technology in the 3D Space

The way I see it, it was only a matter of time before Nordson DAGE brought its X-ray technology into the 2.5D and 3D IC space. The company has long been the leader for X-ray inspection in the electronics market and is now positioned to address the growing need for wafer metrology and defect review in features such as through silicon vias (TSVs). According to John Tingay, Technical Director Nordson... »

Tezzaron, Ziptronix, and Invensas Demonstrate Interconnectology in Action

Tezzaron, Ziptronix, and Invensas Demonstrate Interconnectology in Action

It may have been a coincidence that at last week’s 3D ASIP Conference, Invensas, Tezzaron/Novati, and Ziptronix booths were lined up next to each other in the exhibit hall, but then again maybe it was just Interconnectology in action. News linking Tezzaron/Novati with both Ziptronix and Invensas indicates progress for all three companies in the 3D IC space, and leaves open the question of how lo... »

wet etch
Multicollection

Process-Controlled, Contamination-Free Wet Etch from SSEC

I’ve been following the progress of wet etch processes for TSV reveal steps, with particular focus on SSEC’s efforts in this area, since I first heard SSEC CTO Laura Mauer present on the topic at the European TSV Summit. At IWLPC 2013, I caught up with SSEC’s VP of Marketing, Erwan Le Roy, to learn more about the company’s recent tool enhancement—the MultiPath Collection Drain—introduc... »

Vacuum Dry System
Akrionschematic AkrionSEM copy

Surface Preparation Advancements from Akrion Systems

Sometimes, it’s the seemingly little things that make all the difference. Like for example, who knew that thoroughly drying a wafer is critical to cleaning post TSV etch to achieve optimal surface preparation? At IWLCP 2013 last week, I spoke with Ismail Kashkoush, Ph.D., Akrion Systems’ V.P. of Products and Technology, who presented a paper, Vacuum-Assisted Wet Processing for Advanced 3D ... »

TSMC 3D IC Reference Flows; A Leap Forward for the HMC

TSMC 3D IC Reference Flows; A Leap Forward for the HMC

Big news for 3D ICs this week as TSMC and its OIP Ecosystem Partners announce the release of silicon-validated reference flows for both 3D IC stacks and 16nm FinFETS (everyone else puts the 16nm FinFETS first, but I’m most excited about the 3D IC news.) According to Peter Clarke in EETimes, “silicon validation of these flows signifies the opening up of the manufacturing processes for the desig... »

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