Manufacturing

Vacuum Dry System

Surface Preparation Advancements from Akrion Systems

Sometimes, it’s the seemingly little things that make all the difference. Like for example, who knew that thoroughly drying a wafer is critical to cleaning post TSV etch to achieve optimal surface preparation? At IWLCP 2013 last week, I spoke with Ismail Kashkoush, Ph.D., Akrion Systems’ V.P. of Products and...

Multitest: Handling the Mobility Market

What better way to wrap up a busy week at SEMICON West 2013 than a site visit? After three days of interviews and PowerPoints, I was ready for some some hands-on demonstration. Barbara Loferer, marketing manager of Multitest, was concluding an open-house week at the company’s San Jose facility to promote...

wet etch

SSEC’s New Chemistry for TSV Reveal

This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. SSEC had a lot to celebrate at this year’s SEMICON West, 2013. The company launched two new equipment platforms, WaferStorm and WaferEtch, each configuring single wet wafer processes for specific applications. Two of...

EV Group: Never a Dull Moment

This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. Sitting down with EV Group execs to talk about the company’s latest achievements and contributions to the 3D IC cause has become an annual SEMICON West tradition. In fact, I’ve probably spent more...