European PRO3D Consortium Takes on the Memory Wall
In developing an application to integrate 128 processors on a single chip, ST Microelectronics turned to Leti for assistance. To take on this task, Leti called in reinforcements, organizing and launching the European PRO3D Consortium, with ultimate goal of developing a holistic approach to system design that encompasses software, architecture...Progress is Progress in the Medical Device World
This was my second year attending the Medical Electronics Symposium, and I’m not sure what I was expecting, but when it came to technology advancements themselves, I noticed that not much exciting has happened since last year. Or maybe I’ve just been spoiled. Not every year can be about earth-shattering...Lowering integration risks for 3D TSV products
A critical challenge for fabricating 3D products is the integration of the dies with through-silicon vias (TSVs) into functioning and reliable 3D stacks. As a way to assess and overcome the risks, imec has created the SmartSamples platform. SmartSamples allow validating 3D stacks before the actual product design, avoiding costly...Extending Legacy Technologies into the 3D Space
While TSVs technologies make their way out of R&D on to the manufacturing floor, improvements and developments in non-TSV 3D packaging approaches continue to make waves in the industry. It only stands to reason that for companies already involved in high-volume manufacturing either as a supplier, packaging foundry, or licensor...STATS ChipPAC takes eWLB to 300mm; paves the way for 3D eWLB
Embedded wafer level ball grid array (eWLB) technology has been a hot topic lately on 3D InCites, what with our recent discussion with ST Micro’s Xavier Baraton, and this week’s
