Devices

Update on 3D transistors (That “other” 3D)

I always hesitate to cove 3D transistors, because before they came along, I only focused on what I knew to be 3D – ie: 3D stacked packages, 2.5D interposers and 3D ICs. And that was confusing enough. But then along came Intel’s Tri-Gate technology, claiming the 3D moniker as its...

IMAPS 2012 3D Tweeture Double Feature – Part 1

I spent this whole week at IMAPS 2012 in San Diego, and tweeted live from the event. Sometimes in the Twitter world, it’s difficult to extract full meaning from 140 character tweets, especially when they’re full of hashtags and @othertwitterhandles. And sometimes, we read them and ask, what was the...

When 3D is 3D IC, and When it’s Not

Some of the best news to read (especially on a Friday) is non-news, like this report by Ann Steffora Mutschler, in SemiMD on how 3D ICs will not impact computational lithography tools. According to her sources, this particularly true with regards to TSVs, because of their large size in comparison...

An Incomplete List of 3D Solutions

We read a lot about the remaining challenges to be addressed before 3D ICs are fully commercialized. Current roadmaps are now targeting 2015 for commercialization of 3D ICs, while 2.5D gets the ball rolling towards the end of 2012, beginning of 2013. Reports from Xilinx indicate they are shipping 2.5D...

Ziptronix Takes on 3D Memory

After seeing the latest press release on Ziptronix foray into the memory space, I sought out Kathy Cook, business development manager at Ziptronix, at ECTC to get the full story.  We’ve been reading and hearing a lot about Ziptronix ZiBond process being used in CMOS image sensor (BSI) technology, and particularly...

3D Company Updates

There are a couple of notable updates circulating this week involving companies in the 3D space. The first I saw was news from Sony that it has introduced its next-generation CMOS Image sensor they claim is “ the industry's smallest, CMOS image sensor and camera system”. The image sensor is...

Ziptronix Direct Oxide Bond Technology Gains Momentum

At RTI’s 3D ASIP last week, I sat down with Paul Enquist, of Ziptronix, to get an update on the company’s progress with its direct bonding technologies.  Paul presented on Day 2 of the conference, but honored me with a one-on-one explanation on the application space enabled by the company’s...

Perspectives on 3D Integration: The Researchers

To listen to John Lau, of ITRI, speak on the topic of 3D integration is to experience a passion for technology that rivals no other; except perhaps that of Rao Tummala of Georgia Tech.  But John is definitely more vocal in his passion. Rao has a softer, gentler approach.  At...

3D Integration in Power Devices hits High Volume

When we talk about 3D integration, we’re generally talking about 3D ICs driven by mobile market performance needs. But in the power semiconductor market, computing application performance needs are also spiking due to the increase of content like broadband mobile video and 4G communications. At the same time, telecommunications and...

Going UP! Next-Generation IC Assembly

Coverage of the GSA Memory Conference continues in this week's issue of Chip Scale Review Tech Monthly. Francoise von Trapp contributed this article. While there continue to be incremental improvements and innovations in single chip packaging technologies, it’s nothing compared to the focus on multi-chip assembly and packaging technologies. Whether...

TSVs Find Their Way into Prototypes

Designing and building a prototype MEMS device with TSVs in it is pretty much unheard of.  As Alissa Fitzgerald, Ph.D., founder and managing member of AM Fitzgerald &Associates explains it, TSVs don’t get introduced into a device until it’s in volume production, rather MEMS devices are developed with either a...

Simulation and Modeling Tools enable 3D MEMS Systems

One of the main themes of last week’s MEMS Executive Congress was to “think outside the chip” (Roger Grace, of Roger Grace Associates) and rather, think of MEMS in terms of the system.  However, to do that, there needs to be interaction between everyone involved in developing said system, including...

European PRO3D Consortium Takes on the Memory Wall

In developing an application to integrate 128 processors on a single chip, ST Microelectronics turned to Leti for assistance. To take on this task, Leti called in reinforcements, organizing and launching the European PRO3D Consortium, with ultimate goal of developing a holistic approach to system design that encompasses software, architecture...