Devices

3D NAND

3D NAND Flash – Towering Spires or Costly Canyons?

The transition to 3D NAND Flash seems to be imminent with projections of it being half the total NAND Flash market by 2016. That means tens of billions of dollars within 3 years. V-NAND is Samsung’s version. Their first publication describing this architecture was released in 2009 and was called...

Getting back to Basics: a Look at 3D NAND and 3D DRAM

There’s been a lot of buzz around 3D NAND in the past few weeks, sparked by Samsung’s recent announcement that it was commercializing its 3D VNAND technology. There’s also been some discussion (mixed with concern) about how, if at all, 3D NAND might affect the commercialization of TSV-based 3D DRAM...

3d NAND

Comparing Samsung’s 3D NAND with Traditional 3D ICs

At last week’s Memcon 2013, which took place Tuesday, August 6, 2013, at the Santa Clara Convention Center, Keynoter Bob Brennen, Senior VP at Samsung, talked about the need for New DRAM and Flash Memory architectures. Richard Goering summarized Brennan’s keynote very well in his blog post. Because Brennan’s responsibility...

Momentum Builds for the 2013 3D InCites Awards

Subscribers are practically blowing up 3D InCites as they duke it out online and race the  July 3rd deadline for casting their ballots in the public opinion poll for this inaugural 3D InCites Awards; which is great because the first 3D InCites Awards Breakfast, co-presented by 3D InCites and TechSearch...

Technology Updates at ECTC 2013

The ECTC 2013 stats are in. This year showed increases across the board with: Over 1,300 attendees, the highest attendance ever, from 26 countries 377 technical papers, presented in 36 oral and five interactive presentation sessions, including a student poster session 12 sessions focused on 3D/TSV, including several of the...

MonolithIC 3D's PDN concept f removing heat from 3D ICs.

Tying up 2012 3D IC Loose Ends

I don’t know about you, but I always find that amidst the holiday hubbub, the really important stuff gets shoved aside and falls through the cracks. Just in case you missed them, here are some good 3D related posts that may have been lost in the December race to “get...

3D Company Updates

There are a couple of notable updates circulating this week involving companies in the 3D space. The first I saw was news from Sony that it has introduced its next-generation CMOS Image sensor they claim is “ the industry’s smallest, CMOS image sensor and camera system”. The image sensor is...

2.5D and 3D FPGA Update

Ever since TSMCs Open Innovation Platform (OIP) event, we’ve been hearing all about how the company has qualified its 2.5D chip-on-wafer-on-substrate (CoWoS) process flow, announced its test vehicle, and has begun shipping products. Indeed, at Roadmaps for Multi-die Packaging (November 14, 2012) Jan Vardaman used Altera’s adoption of the CoWoS test...

Multi-Die Integration Provides Multifaceted Solutions

Multi-Die Integration Provides Multifaceted Solutions By Francoise von Trapp, 3D InCites  This year’s Roadmaps for Multi-Die Integration Symposium, hosted by MEPTEC on November 14, 2012 at the Biltmore Hotel in Santa Clara, CA, offered some interesting and different perspectives than the garden-variety 2.5D and 3D IC conferences of late. While...

What 3D Means in eWLB

Last week (November 6) STATS ChipPAC issued a press release announcing that its advanced eWLB provides a platform for 2.5D and 3D technologies.  In search of further information about this, I found a feature article recently published in Solid State Technology that explained how eWLB can be leveraged for 2.5D and...

3D Technology Features in Review

The latest digital issues of Chip Scale Review and  iMicronews’ 3D Packaging magazines hit the virtual “stands” last week, and perhaps in honor if the 3D ASIP Conference that gets underway later this week, there are some hot new 3D technologies being featured. But first, to bring everyone up to...

This Week in 3D IC News (Oct 8-12)

All Programmable PlanetToday All Programmable Planet’s newsletter appeared in my inbox, with a great post by Max Maxfield on the Xilinx family of 3D FPGAs.  Beyond the detailed descriptions of Xilinx’ products, and explanation between the difference between 3D FPGA and 3D Heterogeneous FPGA, I especially like Max’s musings on...

Some 3D Technology Tidbits

Glass interposers got a thumbs up from i-MicroNews in a “Closer Look” post reviewing Corning’s Peter Bocko’s presentation at IMAPS 2012.  Based on work done as part of Ga Tech’s consortium, Bocko demonstrated that “glass interposers show less warp during chip assembly, faster signal propagation and significantly reduced signal loss.  In...

Just another 3D Monday

For me, Mondays are about regrouping, getting out of weekend head and into what’s going on in the 3D world. (I confess, I do leave my work at the office!) Mostly I cruise around looking to be inspired. Here’s what was waiting for me today. Symmetry is an online magazine...

SEMICON Taiwan’s 3D Tech Forum: Were You There?

I didn’t make it to the SEMICON Taiwan SiP Global Summit this year and was hoping to find some coverage by other journalists so that I could at least curate and share the information on the 3D IC Technology Forum. Unfortunately, I didn’t see anything posted on the topic, but...