Design and Test Solutions are Trending in 3D ICs

These days, as I troll the pages of the Internet in search of juicy tidbits of 3D IC news and information, I’ve realized that with the exception of that pesky issue with thin wafer handling, focus has moved away from novel manufacturing processes, and turned its magnifying glass onto the world of design, test, reliability, signal and power integrity, ESD challenges, and so forth. This is proving »

3D Company Updates

There are a couple of notable updates circulating this week involving companies in the 3D space. The first I saw was news from Sony that it has introduced its next-generation CMOS Image sensor they claim is “ the industry's smallest, CMOS image sensor and camera system”. The image sensor is a system-on-chip stacked structure featuring backside illumination (BSI). This is exciting progress for ... »

DATE’10 3D Integration Workshop addresses applications, technology, architecture, design, automation, and test’

3D Workshop organizers Erik Jan Marinissen (IMEC), Yann Guillou (ST-Ericsson) Geert Van der Plas (IMEC) report back from a very successful second year at DATE, 2010 in Dresden, Germany. »

Design community speaks out on 3D

I think maybe the design community is tired of being referred to as “a limitation” just because the tools aren’t ready yet. I think they are also tired of being the scape goat. »

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