Design and Test Solutions are Trending in 3D ICs
These days, as I troll the pages of the Internet in search of juicy tidbits of 3D IC news and information, I’ve realized that with the exception of that pesky issue with thin wafer handling, focus has moved away from novel manufacturing processes, and turned its magnifying glass onto the world of design, test, reliability, signal and power integrity, ESD challenges, and so forth. This is proving »
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