Design

E-System Design: Sphinx 3D Path Finder (“3DPF”) V3.0

The Sphinx 3D Path Finder (3DPF) is an exploration tool enabling fast test case creation and analysis for silicon and glass interposers containing: solder balls, pillars, bond wires, TSV/TSG as well as RDL interconnect structures. E-System Design: Sphinx 3D Path Finder (“3DPF”) V3.0 All based upon a patented simulation engine with the...

Making Progress with 3D IC Design and Test

Thank you, Ann Steffora Mutschler (Semiconductor Engineering) for getting to the bottom of the difference of EDA tools for  2.5D and 3D IC design and test, and providing such a clear explanation in your post, “Evolution vs. Revolution”. In this 2-part post, Mutschler explores the EDA vendor arguments that “tool...

3D IC Design: Outlook for 2014

To date we at Mentor Graphics have seen a handful of 3D IC design releases, and even more customer evaluations. However, the predominant driver seems to be a desire to understand the space in case their company elects to move into the space. In general, the perception seems to be...

2.5D Interposer Innovations from Silex and eSilicon

2.5D interposers sparked a good amount of discussion at this year’s 3D ASIP conference (December 11-13, 2013, Burlingame CA), with a session devoted to “Interposers for all of Us” and other presentations scattered throughout the program to address such issues as thin wafer handling, and heterogeneous integration. Weighing in on...

Momentum Builds for the 2013 3D InCites Awards

Subscribers are practically blowing up 3D InCites as they duke it out online and race the  July 3rd deadline for casting their ballots in the public opinion poll for this inaugural 3D InCites Awards; which is great because the first 3D InCites Awards Breakfast, co-presented by 3D InCites and TechSearch...