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A long-time evangelist of 3D integration technologies, Herb Reiter puts more than 20 years of experiences in technical and business roles at semiconductor and EDA companies to work, providing a holistic perspective and insight on how to bring 3D integration to the masses.

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Highlights from HotChips 2014: 21 HBM Design-ins Ongoing!

Last week, HotChips 2014 (aka HC26) was held at the Flint Center within the De Anza College in Cupertino, California. As in many previous years, I attended both the Sunday tutorial and the main conference on Monday and Tuesday. As usual, there were great keynotes and lots of interesting technology news. The tutorial always focuses on an important technology or market trend. This year was no e... »

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Apple and IBM on the Way to Demonstrate That ONE plus ONE is More Than TWO

Tuesday’s (July 15) Nightly Business Report surprised me with an – in my view – very important announcement: Apple and IBM are going to cooperate to offer enterprise solutions. See more about this significant step here and in many other headline news coming out this week. The former rivals are joining forces to combine Apple’s user-friendly hardware with IBM’s enterprise experience and s... »

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Should EDA vendors, OSATS, and their customers cooperate more?

Last week, I attended the packaging-focused 64th Electronic Components and Technology Conference (ECTC) 2014 in Orlando. This week I spent three days at the EDA-focused 51st Design Automation Conference in San Francisco. In addition to realizing that these two locations are about three thousand miles apart, I noticed that the packaging and EDA camps are still far apart in regards to share of mind ... »

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Will the Internet of Things Change the Way We Look at 2.5D and 3D ICs?

Years ago I saw Dr. Wayne Dyer on Public Television. He talked about “The Power of Intention”. The engineering-driven half of my mind didn’t pay much attention to such a mushy topic…. until Dr. Dyer confused me with what sounded like a play on words. He said “When you change the way you look at things, the things you look at change!” Thanks to my digital video recorder, I was able to g... »

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Circumventing Temporary Bond/Debond, and other Cost-Saving Approaches to 2.5D Interposers

While GLOBALFOUNDRIES and STATS ChipPAC may have it all figured out, there are many who still consider temporary bond/debond (TB/DB) to be an unsolvable challenge that adds unnecessary cost. The solution? Find a way to do away with it altogether. During the 3D IC Forum at SEMICON Singapore, both A*STAR Institute for Microelectronics (IME) and Invensas Technologies demonstrated that the best way ov... »

A Sneak Peek at IITC and AMC 2014

The recent announcement of the International Interconnect Technology Conference (IITC), combined with the Advanced Metallization Conference (AMC) in the Double Tree Hotel in San Jose, from May 20-23, caught my eye, because it also offers several sessions relevant for 3D-IC materials and manufacturing. On Tuesday, May 20, will be a day-long Workshop on “Manufacturing of Interconnect Technologies:... »

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When You Come to a Fork In the Road, Take It

When Yogi Berra made this very wise statement, he certainly didn’t mean to give specific advice what to choose. I interpret his statement as an encouragement to make an educated decision and pick the best alternative, whenever you come to a fork in the road. The semiconductor industry is facing such a fork in the road to continued success. As the attached slide from last year’s CDN Live confer... »

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Breaking Down Walls between Board, Package, and IC Design Steps

Many years ago, when I started in the semiconductor business, the circuit designers only had to worry about functionality and, after completing their job, “threw the design over the wall” to the layout team or contractor. As recently as 10 years ago, IC designers only had to worry about silicon performance and after verifying functionality and timing, they “threw the design over the wall” ... »

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READY – AIM – FIRE! Predictions for 2.5D ICs in 2014

Major SoC vendors, like Intel and IBM, started development work on 3D ICs more than a decade ago, but so far, economics have discouraged them from starting volume production. Ho-Ming Tong, CTO, ASE, and his team realized a few years ago that vertical stacking of logic die and/or heterogeneous functions did (and still do) require major engineering efforts and significant business model changes befo... »

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Thoughts on 2.5D and 3D IC Progress, as Presented at IWLPC 2013

The 10th International Wafer-level Packaging Conference (IWLPC 2013) was held at the DoubleTree Hotel in San Jose this week. I had an opportunity to attend part of the technical sessions and the keynote Invensas’ president, Simon Mc Elrea, presented on Thursday morning. I also enjoyed the 3D Panel, moderated by Sitaram Arkalgud, formerly at SEMATECH, now at Invensas, on Thursday afternoon. If yo... »

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