A long-time evangelist of 3D integration technologies, Herb Reiter puts more than 20 years of experiences in technical and business roles at semiconductor and EDA companies to work, providing a holistic perspective and insight on how to bring 3D integration to the masses.


The Great Divide Between Semiconductor Design and Manufacturing

Shortly before the summer break started, I attended a number of industry conferences: MEPTEC, ECTC, DAC, MEMS & Sensors, ASME and SEMICON West. At all of them, I clearly noticed that our industry is looking beyond “Moore’s Law” to advanced IC packaging, multi-die ICs, and system scaling. However, at every one of these conferences, I also noticed the “Great Divide”: It’s difficult t... »


DAC 2016: There is More to Life than IC Design, Part 2

Part 1 of my DAC 53 reporting focused on this year’s really impressive keynotes, now posted on the DAC website, together with videos of other remarkable pavilion presentations, panels, interviews, demos, etc.…. Part 2 will cover a few highlights that I found very interesting and useful at DAC. Considering that this blog is being posted on 3D InCites, let’s talk about CEA Leti’s 3D network-... »


DAC 2016: There is More to Life than IC Design

In the past, the Design Automation Conference was known to me and many of my colleagues as the annual event that focused on IC design tools, flows, and methodologies. EDA tools vendors and users got together in the previous millennium to discuss what to do next in a rapidly growing market segment. Then things changed… At the beginning of this millennium, the wafer foundries took charge of silic... »

Looking Beyond the Components Horizon at ASME’s IoT Connect.

Every time someone asks me how my years experience I have, I tend to get evasive or try to turn it into something funny. At a recent conference, the speaker before me admitted that he is OLD and told us that he has 30 years of experience in semiconductors. When it was my turn I admitted that I am ANCIENT, because I have almost spent a decade more in our component-level semiconductor industry. W... »


Transforming Today’s Semiconductor Industry Challenges into Tomorrow’s Opportunities

My wife, born and raised in Hong Kong, tells me that the Chinese language uses the same word for challenge and opportunity. What can we, in the 200-year-old  US of A, learn from the 4000 years old Chinese culture? The Chinese have a point! Based on my personal experience, I have to say that every challenge I faced so far, opened a door to a new opportunity, making my life better and more interest... »

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22nd TSMC Symposium Conveys Accomplishments and Looks at the Road Ahead

Earlier this week I had the opportunity to attend this year’s TSMC Symposium. Just like in many previous years, TSMC had a lot of progress to report and demonstrated that they have a clear vision of the road ahead. As I expressed in previous years’ blogs, I started to get to know TSMC as a formidable competitor when I was marketing ASIC solutions at VLSI Technology. TSMC led the transition fro... »


HBM Supply Chain Seminar Highlights System-level Advantages

The Computer History Museum in Mountain View is a very impressive place to show you the enormous progress ICs and Electronic Systems have made in the most recent 50+ years. What I like even more is the fact that an increasing number of high-tech companies and industry organizations are utilizing this great facility for charting our future path on the innovation curve with exhibitions, seminars, wo... »

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DesignCon 2016: Where the Chip meets the Board and Great Ideas Come to Life

DesignCon 2016 at the Santa Clara Convention Center gave football fans among us an opportunity to watch the preparation work for Super Bowl 50. Right across the street from the Convention Center is Levi Stadium, where on Sunday, February 7, this year’s champion will be crowned. Impressive, but let’s not digress and focus on DesignCon. For me, in my role as business developer for innovative pro... »

‘Tis the Season for the 3D ASIP Multi-Die IC Design Tutorial

While the shopping malls and specialty stores in and around San Francisco were packed with people hunting for Holiday presents, a very dedicated crowd of 3D IC developers and users from all over the world got together near San Francisco, for the 12th 3D ASIP conference, which featured, once again, the multi-die IC Design Tutorial. Conference presenters reviewed the progress made in 2015 and discus... »

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IC Packaging: An Essential Enabler and Differentiator, Part 2

The Great Miniaturization … SEMI/MEPTEC Conference Nov 10 & 11, continued from Part 1.  Wednesday morning started with a IC packaging session focused on my favorite subject: Multi-die Integration. Trevor Yancey, who recently joined Jan Vardaman at TechSearch International, talked about the IoT and gave an example for how the many sensors on a manufacturing floor will minimize downtime, impr... »

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