A long-time evangelist of 3D integration technologies, Herb Reiter puts more than 20 years of experiences in technical and business roles at semiconductor and EDA companies to work, providing a holistic perspective and insight on how to bring heterogeneous ntegration to the masses.

IMG_0712 IMG_0729

The Path to Smarter Fabs

Working from the mantra “None of us knows as much as all of us,” SEMI invited manufacturers of electronic components and systems to come together and discuss how to build smarter fabs and reap key benefits like lower cost, faster turnaround as well as higher quality and more reliable products. The second annual Smart Manufacturing Workshop, held September 12, provided a very sensible a... »

The Importance of Fully Characterized Semiconductor Materials

More than 20 years ago, the cooperation between fabless IC vendors and wafer foundries started to dominate over the integrated device manufacturing (IDM) business model and established clear interfaces between design and manufacturing companies. Ever since IC designers can only create a single-die system-on-chip (SoC) design if a process design kit (PDK) informs them about their wafer foundry part... »


The Need For and Value of Semiconductor Industry Organizations

Recognizing the need for and value of semiconductor industry organizations, in 1994, Jodi Shelton and CEOs of fabless IC companies founded the Fabless Semiconductor Association (FSA). The traditional integrated device maker (IDM) business model was declining and the need for close cooperation between IC designers at fabless IC companies (Broadcom, Nvidia, Qualcomm, etc.) and more cost-effective wa... »


How to Transform Innovative Technologies Into Customer-Specific Solutions

Technology innovations don’t reach customers right away. It takes careful collaboration with the right partners to transform a new and innovative technology into high-value, customer-specific solutions. »

YoleFig1 YoleFIg2 YoleFig3 YoleFig4 YoleFig5

What is Happening to the Memory Market?

Because memory represents typically about half the silicon content of a system, and multi-die packages typically combine many memory devices with one or more logic dice, I made it a point to attend both Yole Développement’s Executive Memory Breakfast and The Flash Summit on August 6th.  I, along with about 100 other industry executives, had to get up very early to make the 7 am breakfast meeti... »

Figure2 Figure3

Advanced SiPs Help More than Moore Reach Maturity

Earlier this summer, 175 system-in-package (SiP) experts from all over the world met at the Marriott Hotel in Monterey’s Old Town at the IMAPS Advanced SiPs Conference. This conference focused exclusively on innovative SiP technology developments and trends, demonstrating that a significant part of the value creation is moving from the silicon to the package. Nozad Karim, VP: SiP/System Integrat... »

SW2Fig1 SW2fig2 SW2Fig3 IMG_0374 IMG_0387 SW2Fig6

New Details About More-than-Moore Test Technology Advances

SEMICON West and the Electronic System (ES) Design West were, for the first time, co-located at the Moscone Center in San Francisco, from July 9 to 11, 2019. In addition to most keynotes, I reported about here, This blog talks about some in-depth technical presentations on test and the progress many companies made in support of “More than Moore” technology. The Test Vision Symposium The most i... »

HerbHero LisaSu FIgure 2

SEMICON West Keynotes Look to a Future Beyond Moore’s Law

Reporting from the SEMICON West keynote talks, Herb Reiter relays the perspectives of industry experts on everything from More than Moore, to hot topics and future technologies. »


The Importance of a Well-coordinated Semiconductor Supply Chain

Would you buy your next hotdog in parts, from un-coordinated suppliers? For example: Get the bun from a baker, the sausage from a butcher, mustard and/or ketchup and veggies from the nearest supermarket…?  If yes, you may find the sausage being too small, the veggies too big for the bun, and, when you finally finished adding mustard/ketchup and start eating, you may “enjoy” a cold sausage o... »

u2ufig2 u2ufig3 u2ufig4 u2ufig6 u2ufig7

U2U 2019 Conference Dives into 2.5/3D IC Design

Key advanced packaging technology influencers came out in force to discuss the status of  EDA tools for 2.5D/3D IC package design at the recent User to User (U2U 2019) Conference, organized by Mentor, A Siemens’ Business and hosted at the Santa Clara Marriott. Presenters from Wave Computing, ARM, Amkor, TechSearch International Inc., and Qualcomm lent their voices to the cause. Technology T... »

Page 2 of 101234»