3D In Context

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A long-time evangelist of 3D integration technologies, Herb Reiter puts more than 20 years of experiences in technical and business roles at semiconductor and EDA companies to work, providing a holistic perspective and insight on how to bring 3D integration to the masses.

ECTC 2015: From the Tech Sessions Part 2

As promised in part 1 of my ECTC 2015 blog about this impressive conference, see below summaries of presentations I found very useful to contribute to the advancement of single- and multi-die packaging. To make it easier for the reader to dig deeper and review the entire paper, I included in...

EDPS 2015 Looks At IC Innovations from the Design Perspective

On Thursday and Friday of last week, Monterey, California’s previous state capital, became the center of presentations and discussions about IC design challenges as well as latest innovations / progress made in the field of EDA tools and IC design methodologies at Electronic Design Process Symposium (EDPS) 2015. We also learned a...

Image Courtesy of TSMC Ltd.

TSMC 2015 Technology Symposium Highlights Plans for the Coming Year

Last Tuesday, April 7, was another important day for Silicon Valley. TSMC 2015 Technology Symposium celebrated 21 years of holding this annual event to update TSMC’s loyal customers and win new ones. Rick Cassidy, President TSMC North America, opened the symposium with a long list of impressive numbers about TSMC and put them into...

DesignCon 2015: Blasting Through Walls with Holistic Planning

DesignCon’s 2015‘s tag-line “where the chip meets the board”, was a very appropriate message, and summarized in a few words a major trend in our semiconductor- and electronic systems industry: The increasing need for holistic planning as well as modeling of building blocks, not only for better up- and down-stream...