A long-time evangelist of 3D integration technologies, Herb Reiter puts more than 20 years of experiences in technical and business roles at semiconductor and EDA companies to work, providing a holistic perspective and insight on how to bring 3D integration to the masses.
About 70% of the U.S. Gross Domestic Product (GDP) is driven by consumer demand. What consumers are looking for is influenced by, for example, fashion trends, product innovations, environmental forces, and personal interests. Regarding personal interests: Sales of electronic components at Fry’s are poor, Radio Shack stores even vanished completely....
Several decades ago, Asia began its quest to be a reliable and cost-effective IC packaging, assembly, and test partner for low complexity ICs. Since then, Asia has proven itself as the world’s dominant wafer manufacturer and developer of process technologies, down to smallest feature sizes. On August 4, 2020, I...
In the early days of ASIC technology, only logic library elements and basic I/Os with up to 10s of transistors were available for customizing gate arrays and/or logic functions in standard cell chips. And then, “megacells” (a.k.a. Functional Blocks, Semiconductor IP Blocks), comprised of 100s, even 1000s, and more transistors...
In a recent MEPTEC / iMAPS webinar, Jan Vardaman, President, and Founder of TechSearch International presented growth drivers for advanced packaging and related technology innovations to meet market demand. Unlike in previous years, when she had to spend part of her MEPTEC presentation explaining what the term “advanced packaging” means and...
About 50 years ago, I started my career as a system-level designer, focused on an interface card for the Siemens T 1000. It was the first electronic teletype, destined to ship in extremely high volumes all over the world. When Siemens ramped up production, they invited me to the factory...
In engineering school, I learned that different laws of physics apply when the widely used electricity with 50/60 Hertz gets into the Gigahertz or even Terahertz range. In the decades since, I have managed to keep a safe distance to this challenging world of radio frequencies (RF) needed for transmitting...
In my alliance management roles at electronic design automation (EDA) companies, I arranged many presentations to convey the benefits of EDA tools to IDMs, fabless IC vendors, and wafer foundries. Some of our EDA marketing people passionately presented their products’ strengths and demonstrated in-depth EDA knowledge. However, speaking fast, with...
When I switched my focus from single-die SoCs to multi-die ICs, I had to learn a lot about IC packaging technologies. I paid thousands of dollars to attend 3DIC conferences, tutorials, and to purchase 3DIC books. This month (June 3 to 30, 2020) you can get up-to-date info about the...
In Austria, where I grew up, homes get passed on from generation to generation. Like many Austrians, I had a set of tools to repair plumbing, electrical, heating, and other equipment, to keep our old home comfortable. As a proud handyman, I took all my tools with me, when I...
On May 20 MEPTEC’s Executive Director, Ira Feldman, moderated another informative MEPTEC & iMAPS webinar. Two Knowledgeable speakers from Ansys and International Test Solutions (ITS) outlined their company’s technical capabilities and explained the value these tools and methodologies provide for multi-die IC design and test. Modeling and Simulation of Multi-die...
