EV Group and Fraunhofer IZM-ASSID personnel next to an EVG®850 DB fully automated UV laser debonding and cleaning system installed in Fraunhofer’s newly established Center for Advanced CMOS and Heterointegration Saxony (CEASAX) in Dresden, Germany. From left to right: Gerald Silberer, Regional Sales Director Europe (EV Group); Dr. Andreas Gang, Group Leader Pre-Assembly / Wafer Bonding (Fraunhofer IZM-ASSID); Dr. Manuela Junghähnel, Site Manager (Fraunhofer IZM-ASSID); Markus Wimplinger, Corporate Technology Development & IP Director (EV Group); Andreas Pichler, Regional Sales Manager Europe (EV Group); Robert Wendling, Technical Assistant Wafer Bonding (Fraunhofer IZM-ASSID); and Dr. Frank Windrich, Deputy Site Manager (Fraunhofer IZM-ASSID). © Fraunhofer IZM / Silvia Wolf. 

EV Group and Fraunhofer IZM-ASSID personnel next to an EVG®850 DB fully automated UV laser debonding and cleaning system installed in Fraunhofer’s newly established Center for Advanced CMOS and Heterointegration Saxony (CEASAX) in Dresden, Germany. From left to right: Gerald Silberer, Regional Sales Director Europe (EV Group); Dr. Andreas Gang, Group Leader Pre-Assembly / Wafer Bonding (Fraunhofer IZM-ASSID); Dr. Manuela Junghähnel, Site Manager (Fraunhofer IZM-ASSID); Markus Wimplinger, Corporate Technology Development & IP Director (EV Group); Andreas Pichler, Regional Sales Manager Europe (EV Group); Robert Wendling, Technical Assistant Wafer Bonding (Fraunhofer IZM-ASSID); and Dr. Frank Windrich, Deputy Site Manager (Fraunhofer IZM-ASSID). © Fraunhofer IZM / Silvia Wolf.