Archives November 2019 - 3D InCites

IFTLE 432: Ferric and TSMC Partner on Voltage Regulators; High TC Die Attach for TIM?

IFTLE 432: Ferric and TSMC Partner on Voltage Regulators; High TC Die Attach for TIM?

The IMAPS International Symposium took place this year in Boston. Let’s take a look at a few of the more interesting presentations that were given there. Ferric and TSMCs Partner on Voltage Regulators In their paper “Package Voltage Regulators: An Answer for Power Management Challenges” Ferric describes their package voltage regulators (PVRs) that reportedly are the industry’s first si... »

Microtech Ventures brings a New MEMS and Sensors Summit to Town

Microtech Ventures brings a New MEMS and Sensors Summit to Town

From November 5 to 7, 2019, I had the opportunity to attend the inaugural MEMS and sensors focused Microtech Innovation Summit at the DoubleTree Hotel in San Jose. I have to admit, until recently I didn’t follow MEMS and sensors (M&S) and didn’t notice the broad and rapid market acceptance of these products (Figure 1). They capture real-world data – which is analog and multi-physics – ... »

MRSI receives Laser Focus World Innovators Award for HVM Die Bonder

MRSI receives Laser Focus World Innovators Award for HVM Die Bonder

MRSI Systems (Mycronic Group) a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2019 Silver Honoree for the Laser Focus World Innovators Award in the Manufacturing Equipment for Photonic Components category. The MRSI-HVM was recognized for a very good innovation that resulted in marked improvement over previ... »

Chiplets: Key Enablers for the Next 10-20 Years

Chiplets: Key Enablers for the Next 10-20 Years

Continued monolithic integration is expensive and can suffer from the defect density yield loss associated with large die. As a result, an increasing number of companies are turning to new architectures using chiplets to achieve the economic advantages lost with expensive monolithic scaling. TechSearch International’s new Advanced Packaging Update (APU) details many advantages of chiplets and pr... »

Siemens and Qualcomm Set Up First Private Standalone 5G Network in Industrial Environment

Siemens and Qualcomm Set Up First Private Standalone 5G Network in Industrial Environment

· Sustainable technological cooperation for the future of industrial wireless communication · Joint Proof of Concept in a real industrial environment using the 3.7-3.8 GHz band · Researching the capabilities of 5G standalone networks for industrial applications Siemens and Qualcomm Technologies, Inc. have implemented the first private 5G standalone (SA) network in a real industrial environment ... »

Indium Corporation’s Andy Mackie Talks About Materials Science

Indium Corporation’s Andy Mackie Talks About Materials Science

“We believe that materials science changes the world,” declared Indium Corporation’s Andy Mackie during our recent sit-down together at IMAPS 2019 in Boston, MA. Even though I am a chemical engineer myself, and not a materials scientist, Andy Mackie, Ph.D., senior product manager, is reaching the choir, one engineer to another, right from the start, talking about Indium Corporation’s mater... »

Cu-Interposer Drives Connectivity to the Next Level

Cu-Interposer Drives Connectivity to the Next Level

Plan Optik AG, the leading manufacturer of customized wafers from glass, quartz or glass-silicon compound materials has launched its new Cu-Interposer technology at SEMICON Europa 2019. The progressive miniaturization, increasing integration density, and requirements for more powerful signal routing create the need for 3D integration. Interposer technologies for rewiring have been developed for ef... »

SEMICON Europa and Productronica 2019 Exhibitor Showcase

SEMICON Europa and Productronica 2019 Exhibitor Showcase

The trade show floors at the combined SEMICON Europa and Productronica events can be daunting. In past years, we’ve focused our visits on the SEMICON Europa exhibitor floor, but as the lines fade between front-end processes, advanced packaging, and board assembly, getting the whole story called for visits to the Productronica halls as well. We had some great discussions about recent mergers, col... »

SEMI, Partners Launch Largest Microelectronics Education Initiative

SEMI, Partners Launch Largest Microelectronics Education Initiative

SEMI and 19 partners from 14 countries today launched a microelectronics education initiative to fill the skills gap and boost workforce diversity by tightening collaboration between the microelectronics industry and education providers. The project, dubbed METIS – Microelectronics Training, Industry and Skills – will focus on the skills and related training needed to support emerging vertical... »

Uniting the World Through Technology Innovation

Uniting the World Through Technology Innovation

What a week we just had at the Munich Messe in Germany! If you’ve never had the chance to attend SEMICON Europa and Productronica simultaneously, I highly recommend you put it on your must-do list. Not only will you reach your daily step goal, but you’ll also learn about the latest in technology innovation, see how integrated the electronics supply chain has become, and get to meet with many o... »

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