Archives September 2019 - 3D InCites

5G: The Battle Still Rages

5G: The Battle Still Rages

Consumer demand for mobile phones weakened in 2018, resulting in a market decline. In this context, the competition has intensified, creating an emulation to push 5G forward. Yole Développement (Yole) announces an 8% CAGR[1] between 2018 and 2025 for the RF[2] front-end market. Reaching US$15 billion in 2018, this industry should reach US$25.8 billion by 2025, confirms the RF electronics team at ... »

IFTLE 426: Exascale Computing is Near; Incandescent Lightbulbs get a Reprieve     

IFTLE 426: Exascale Computing is Near; Incandescent Lightbulbs get a Reprieve     

Earlier this year, John Shalf, department head of Computer Science at Lawrence Berkeley National Labs (LBNL) presented a plenary presentation entitled “The Future of Computing Beyond Moore’s Law” (SEMICON West, July 2019). The premise espoused was one which you have read many times in IFTLE, i.e. now that CMOS scaling has come to an end: What’s next, and where are we going? Exascale comput... »

Exhibitor Highlights at IMAPS International Symposium

Exhibitor Highlights at IMAPS International Symposium

The 52nd International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS) starts next week. Key package platforms will include system-in-package (SiP), system in module (SiM). chip-package interaction (CPI), wafer level/panel Level, 2.5D/3D/flip chip/optical, as well as high reliablity/performance, and advanced process/materials. I... »

A Look at US Investments in Heterogeneous Integration

A Look at US Investments in Heterogeneous Integration

The semiconductor industry is not only very capital-intensive, but investors experience very long payback times. Both limit the availability of private funding. If you are jealously looking at China and the billions of dollars they invest in semiconductors, I recommend you make a closer study of US investments in heterogeneous integration, and specifically DARPA. DARPA Heterogeneous Integration In... »

The Path to Smarter Fabs

The Path to Smarter Fabs

Working from the mantra “None of us knows as much as all of us,” SEMI invited manufacturers of electronic components and systems to come together and discuss how to build smarter fabs and reap key benefits like lower cost, faster turnaround as well as higher quality and more reliable products. The second annual Smart Manufacturing Workshop, held September 12, provided a very sensible a... »

Supporting the 3D Megatrend in Semiconductor Manufacturing

Supporting the 3D Megatrend in Semiconductor Manufacturing

We’ve waited a long time for this, and now it’s here. There is a 3D megatrend happening in semiconductor manufacturing, as scaling alone does not meet the sophisticated computing needs of Industry 4.0 applications like blockchain, 5G, the internet of things (IoT), autonomous transportation, telemedicine, and more. These emerging technologies call for more advanced technologies like artificial ... »

Is Fan-Out Packaging Still Popular?

Is Fan-Out Packaging Still Popular?

“Although the inflated excitement has started to plunge after few years of hype, fan-out technologies are still very well established in low-end and high-end applications”, asserts Favier Shoo, Technology & Market Analyst at Yole Développement (Yole). “It has proven benefits in terms of form factor with no IC substrates, performances with increased I/O density and reliability with die p... »

IFTLE 425: Deca FOWLP is Going Mainstream; Highlights from Hot Chips

IFTLE 425: Deca FOWLP is Going Mainstream; Highlights from Hot Chips

Deca Technologies has confirmed that its M-Series™ fan-out wafer-level packaging (FOWLP) technology has been adopted by Qualcomm for power management integrated circuit (PMIC) devices in Samsung’s S10, the Xiaomi Mi 9 and LG G8 smartphones. And in other news, advanced packaging was the Cinderella Story at Hot Chips 2019. »

High-Performance IC Substrate Manufacturing Reaches an Inflection Point

High-Performance IC Substrate Manufacturing Reaches an Inflection Point

Driven by advanced packaging substrate needs, the industry has reached an inflection point in IC substrate manufacturing. Increasing I/O counts are driving substrate layer counts to more than 20. Larger die sizes and multiple die mounted on the substrate are driving the need for larger body sizes, up to 100 mm x 100 mm. Some companies use a silicon interposer with multiple redistribution layers (R... »

EPS 2019: Imagining Thomas Edison as the Father of Advanced Packaging

EPS 2019: Imagining Thomas Edison as the Father of Advanced Packaging

Thomas Alva Edison didn’t invent semiconductor device packaging, but he might have, had he lived just one more generation. “I find out what the world needs. Then I go ahead and try to invent it.”* Edison passed away in 1931, less than twenty years before John Bardeen, Walter Brattain, and William Shockley invented the transistor at Bell Labs in 1947, starting our electronic age. Bring to you... »