Technology innovations don’t reach customers right away. It takes careful collaboration with the right partners to transform a new and innovative technology into high-value, customer-specific solutions. »
Because memory represents typically about half the silicon content of a system, and multi-die packages typically combine many memory devices with one or more logic dice, I made it a point to attend both Yole Développement’s Executive Memory Breakfast and The Flash Summit on August 6th. I, along with about 100 other industry executives, had to get up very early to make the 7 am breakfast meeti... »
Is advanced packaging production coming back to the USA? The Navy (i.e. NSWC Crane) is currently seeking proposals from the industry for the development of technical and business plans to establish a secure on-shore design, assembly, and test capability. This facility should support the heterogeneous integration of state-of-the-art (SOTA) commercial integrated circuits (ICs) with defense specifi... »
System-technology co-optimization (STCO) – enabled by 3D integration technologies – is seen as a next ‘knob’ for continuing the scaling path. Eric Beyne, imec fellow and program director of imec’s 3D system integration program and Julien Ryckaert, program director 3D hybrid scaling at imec, unravel the STCO principle, open up the 3D technology toolbox and bring up two promising cases: lo... »
Earlier this summer, 175 system-in-package (SiP) experts from all over the world met at the Marriott Hotel in Monterey’s Old Town at the IMAPS Advanced SiPs Conference. This conference focused exclusively on innovative SiP technology developments and trends, demonstrating that a significant part of the value creation is moving from the silicon to the package. Nozad Karim, VP: SiP/System Integrat... »
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