Archives August 2019 - 3D InCites

 IFTLE 424: Fingerprint Sensors Are Going Ultrasonic 

 IFTLE 424: Fingerprint Sensors Are Going Ultrasonic 

IIFTLE is always on the lookout for technologies that will require advanced packaging solutions. Fingerprint sensors for today’s latest smartphones appear to be one of those applications. Packaging for Fingerprint Sensors DIGITIMes recently reported that  the manufacture of under-display optical fingerprint sensors for use in 5G-enabled phones will require extensive wafer-level backend services... »

MRSI Systems welcomes Hendry He as China Country Sales Director

MRSI Systems welcomes Hendry He as China Country Sales Director

MRSI Systems (Mycronic Group) is pleased to announce our new China Country Sales Director, Hendry He. He will be working alongside the existing sales team and representatives in the region and is based in Shanghai. His substantial technical experience selling semiconductor equipment along with his vast network in the Chinese market is guaranteed to even further enhance our responsiveness to our cu... »

MRSI to Present at 18th ICCSZ OC Market and Technology Seminar

MRSI to Present at 18th ICCSZ OC Market and Technology Seminar

MRSI Systems and CYCAD Century Science and Technology will partner together at the 21st China International Optoelectronic Exposition (CIOE). Product demos will be offered at Cycad’s booth #1C86. The show will be held at the Shenzhen Convention and Exhibition Center from September 4-7, 2019. MRSI Systems will also attend the 18th ICCSZ OC Market and Technology Seminar. This event is organized by... »

Your Electronics Industry Publications, Blogs, and Online Communities Need Your Support

Your Electronics Industry Publications, Blogs, and Online Communities Need Your Support

Everyone in the semiconductor industry seems so shocked by the steady stream of electronics industry publications closures and cutbacks over the past year. From where I sit as both the Founder and Editor of 3D InCites (Aka Queen of 3D), as well as Editorial Director of Kiterocket, none of what is happening surprises me. Indeed, this week’s outpouring of dismay on LinkedIn over the layoffs at Asp... »

The Importance of Fully Characterized Semiconductor Materials

The Importance of Fully Characterized Semiconductor Materials

More than 20 years ago, the cooperation between fabless IC vendors and wafer foundries started to dominate over the integrated device manufacturing (IDM) business model and established clear interfaces between design and manufacturing companies. Ever since IC designers can only create a single-die system-on-chip (SoC) design if a process design kit (PDK) informs them about their wafer foundry part... »

Courtesy of The GSA Twitter feed.

The Need For and Value of Semiconductor Industry Organizations

Recognizing the need for and value of semiconductor industry organizations, in 1994, Jodi Shelton and CEOs of fabless IC companies founded the Fabless Semiconductor Association (FSA). The traditional integrated device maker (IDM) business model was declining and the need for close cooperation between IC designers at fabless IC companies (Broadcom, Nvidia, Qualcomm, etc.) and more cost-effective wa... »

Trymax Receives Order from a Leading-Edge Photonics Research Organization

Trymax Receives Order from a Leading-Edge Photonics Research Organization

NIJMEGEN, THE NETHERLANDS- Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions, today announced it has received an order from NanoLab@TU/e of Eindhoven University of Technology. The NEO 200A series from Trymax with microwave downstream plasma technology was selected to perform resist stripping, descum, and surface cleaning on indium phosphide (InP) wafers. This order il... »

MRSI Improves Accuracy of MRSI-H/HVM-Series Die Bonders To to 1.5µm

MRSI Improves Accuracy of MRSI-H/HVM-Series Die Bonders To to 1.5µm

MRSI Systems (Mycronic Group) is pleased to announce the latest advancement in the MRSI-H/HVM-series line of die bonders. Placement accuracy was tested using industry-standard glass die reference samples. Results showed enhancement from ±3 µm at 3 sigma, to ±1.5 µm at 3 sigma. Moving forward for shipment starting from October 1, 2019, the product names will be MRSI-H and MRSI-HVM (formerly kno... »

IFTLE  423: GLOBALFOUNDRIES and ARM Turn to 3D Chip Stacks for High Performance Computing

IFTLE  423: GLOBALFOUNDRIES and ARM Turn to 3D Chip Stacks for High Performance Computing

A year after GLOBALFOUNDRIES cancels its 7nm program, the company is developing 3D chip stacks fabricated using GLOBALFOUNDRIES’s 12nm FinFET process and features ARM’s mesh interconnect technology in 3D. This alternative to costly node shrinking may help GLOBALFOUNDRIES maintain a market presence. »

How to Transform Innovative Technologies Into Customer-Specific Solutions

How to Transform Innovative Technologies Into Customer-Specific Solutions

Technology innovations don’t reach customers right away. It takes careful collaboration with the right partners to transform a new and innovative technology into high-value, customer-specific solutions. »

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