Archives July 2019 - 3D InCites

SEMICON West Keynotes Look to a Future Beyond Moore’s Law

SEMICON West Keynotes Look to a Future Beyond Moore’s Law

Reporting from the SEMICON West keynote talks, Herb Reiter relays the perspectives of industry experts on everything from More than Moore, to hot topics and future technologies. »

Advanced Packaging Industry: A Wonderful World

The semiconductor industry is at a turning point. The slowdown in CMOS scaling, coupled with escalating costs, has prompted the industry to rely on integrated circuit (IC) packaging to extend the benefits of the More-than-Moore era. Thus, the advanced packaging industry has entered its most successful period, boosted by widespread needs for better integration; the slowdown of Moore’s law; and me... »

Talking about Technology Megatrends at SEMICON West 2019

Talking about Technology Megatrends at SEMICON West 2019

What a difference a year makes. First the aesthetic: after two years of maneuvering around a construction zone at SEMICON West, the Moscone Center renovation is complete and looks fabulous. It’s also so much easier to navigate between halls, and to and from the keynote stage at the newly christened Blue Shield of California Theater. Last year at SEMICON West, the semiconductor industry was flyin... »

IFTLE 419: Update on GlobalFoundries Foundry Status and Cree’s SiC Plans     

IFTLE 419: Update on GlobalFoundries Foundry Status and Cree’s SiC Plans     

Is GlobalFoundries looking for an exit or simply shedding parts of the company that do not fit its new focus? Back in IFTLE 406 we started discussing the persistent rumors that GlobalFoundries  might be “chopped up on the auction block and its businesses sold to specialty foundries that want to supply in those specific areas.” There have been rumors that Abu Dabi Investment Corp. (ADIC), the ... »

EV Group Earns Exceptional Seventh Consecutive Triple Crown Win in VLSIresearch 2019 Customer Satisfaction Survey

EV Group Earns Exceptional Seventh Consecutive Triple Crown Win in VLSIresearch 2019 Customer Satisfaction Survey

EVG continues win streak with 17th consecutive year listed among “THE BEST” suppliers in survey results; frequently cited by customers as best at partnering and recommended supplier EV Group (EVG) today announced that it has once again been voted by customers as one of the 10 BEST Focused Suppliers of Chip Making Equipment and one of 2019’s  BEST Suppliers of Fab Equipment in the 2019 V... »

A Look at imec’s Two-Step Wafer-level Mold Process

A Look at imec’s Two-Step Wafer-level Mold Process

The recipient of the 2019 3D InCites Award for Process of the Year was Belgian research institute, imec, for its two-step wafer-level transfer mold process for 3D die-to-wafer assembly. The individual who nominated them for the award didn’t provide any more detail than that. But luckily at ECTC 2019, when I presented Eric Beyne with the award, he brought along Arnita Podpod, the research enginee... »

IFTLE 418: Xperi DBI Ultra for D2W Hybrid Bonding

IFTLE 418: Xperi DBI Ultra for D2W Hybrid Bonding

Requirements for interconnect pitches of 20µm and below is expected to be the norm in the future. Since typical solder bump technology is not expected to be able to meet those requirements, many companies have been examining Cu-to-Cu direct bonding. Cu-to-Cu bonding can be achieved through one of two ways: Cu-to-Cu thermal compression bonding low-temperature direct bond interconnect, commonly ref... »

SiP Technology To Enable Technology Megatrends

SiP Technology To Enable Technology Megatrends

Two years ago, IMAPS tested the waters for a new conference focused entirely on system-in-packaging (SiP) technologies. They had also recently acquired the 3D Architectures for Semiconductor Integration and Packaging Conference (3DASIP), originally produced by RTI Tech Venture Forum, which took place annually in December in San Francisco. The IMAPS executive committee decided to combine the two co... »

EV Group’s MLE Technology Revolutionizes Lithography

EV Group’s MLE Technology Revolutionizes Lithography

EV Group (EVG) today unveiled its maskless exposure technology (MLE™), a revolutionary next-generation lithography technology developed to address future back-end lithography needs for advanced packaging, MEMS, biomedical and high-density printed circuit board (PCB) applications. The world’s first highly scalable maskless lithography technology for high-volume manufacturing (HVM), MLE combines... »

Analysis Highlights Impact of Trade Friction on Electronics Industry

Analysis Highlights Impact of Trade Friction on Electronics Industry

The impact of the ban on selling components to Huawei combined with generally lower shipments for PCs and mobile phones is having an impact on the electronics industry this year. TechSearch International’s latest analysis examines the impact in terms of the OSAT financials and unit shipments. A market forecast for ball grid arrays (BGAs) and chip scale packages (CSPs) in units by package constru... »

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