Archives May 2019 - Page 2 of 2 - 3D InCites

IFTLE 413: Beware of Technology Hype for the Automotive Market

IFTLE 413: Beware of Technology Hype for the Automotive Market

As packaging practitioners/experts themselves, regular readers know that IFTLE is always on the lookout for the latest applications and the latest chips going into those applications because all those chips will have to be packaged. However, IFTLE has previously warned the reader to beware of technology hype, which appears to be increasing exponentially throughout the decades that I have lived. As... »

ECTC 2019 Will Go Back to Basics to Plan for the Future of Microelectronics and Packaging

ECTC 2019 Will Go Back to Basics to Plan for the Future of Microelectronics and Packaging

Whoa! Where did the time go? ECTC 2019 is only three weeks away and I haven’t written my annual preview post! This year’s event takes place at the Cosmopolitan in Las Vegas, from May 28-31. I’m excited to announce that my good friend and SemiSister, Nancy Stoffel, General Electric Research is this year’s General Chair. I’d tell you about our escapades the last time ECTC was in Las Vegas.... »

ITFLE 412: Samsung Discusses Packaging for the 4th Industrial Revolution; Yole looks at Non-TSV Options

ITFLE 412: Samsung Discusses Packaging for the 4th Industrial Revolution; Yole looks at Non-TSV Options

At the recent IMAPS Device Packaging Conference in Fountain Hills, AZ. Kyung Suk (Dan) Oh, Package Development VP at Samsung, discussed “Electronics Packaging Technologies for the 4th Industrial Revolution” Oh explained that Samsung sees today’s technology paradigm shift as going “beyond Moore” by a convergence of system integration/packaging and software. Based on the slide below, Oh sa... »

Be a Champion for Change – Highlights from the First SEMI Diversity and Inclusion Forum

Be a Champion for Change – Highlights from the First SEMI Diversity and Inclusion Forum

Everyone found their seat as SEMI President and CEO, Ajit Manocha, took the stage to kick off the first SEMI Diversity and Inclusion Forum. Ajit has a lifelong passion for diversity and inclusion. He shared his backstory and the importance of these initiatives to a room full of executives and Human Resources professionals from across the electronics manufacturing industry. Teamwork Makes the Dream... »

TSMC’s 2019 Technology Symposium highlights 25 Years of Innovation

TSMC’s 2019 Technology Symposium highlights 25 Years of Innovation

In 1994 TSMC, a small wafer foundry from Taiwan held its first Technology Symposium. Since 1999 I have had the privilege to work with TSMC and closely follow their success in building a powerful and cost-effective ecosystem for the fabless IC vendors and foundry business model. To measure their success in hard numbers, please check IC Insights’ 2018 revenue estimates here and see that TSMC has a... »

Page 2 of 212