Archives May 2019 - 3D InCites

Women in Semiconductors: A Rising Tide Will Lift All Boats

Women in Semiconductors: A Rising Tide Will Lift All Boats

Like most career women, balancing work and family life is a juggling act, leaving precious little time for hobbies. However, I’ve recently acquired quite a knack for managing NFL fantasy football teams. Despite being a first-time fantasy football manager and the only woman on the team, I was thrilled to win the championship at my workplace! In fantasy football, we assemble a virtual team of play... »

A Non-Techie SemiSister Tackles The Elusive Semiconductor Language

A Non-Techie SemiSister Tackles The Elusive Semiconductor Language

Not all SemiSisters are engineers. In fact, many of us joined this industry from a variety of career backgrounds with non-STEM educations including financial, business management, market research, marketing communications, journalism, and even liberal arts. For us, one of the greatest hurdles to overcome was learning a whole new lexicon of terms that get tossed about every day. In this humorous po... »

Trymax Receives Multi-System Orders from a Top Ten OSAT

Trymax Receives Multi-System Orders from a Top Ten OSAT

NIJMEGEN, THE NETHERLANDS – May 15, 2019. Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions, today announced it has received multi-system orders for its NEO 2000 and NEO 3000 series from a top ten OSAT based in Taiwan. This order will expand the existing NEO install base at the customer in Taiwan and allows Trymax to break into the customer’s fab in China. Shi... »

3D Test: No Longer a Bottleneck!

3D Test: No Longer a Bottleneck!

When I joined imec in October 2008 to work on test and design- for- test (DfT) of 3D-stacked integrated circuits (ICs), there were only a few test folks active in that emerging field. Consequently, misconceptions about 3D test were omnipresent. In the November 18, 2008 issue of Semiconductor International, Alexander Braun wrote: “At a symposium yesterday on 3-D integration, leading expert Philip... »

U2U 2019 Conference Dives into 2.5/3D IC Design

U2U 2019 Conference Dives into 2.5/3D IC Design

Key advanced packaging technology influencers came out in force to discuss the status of  EDA tools for 2.5D/3D IC package design at the recent User to User (U2U 2019) Conference, organized by Mentor, A Siemens’ Business and hosted at the Santa Clara Marriott. Presenters from Wave Computing, ARM, Amkor, TechSearch International Inc., and Qualcomm lent their voices to the cause. Technology T... »

IFTLE 413: Beware of Technology Hype for the Automotive Market

IFTLE 413: Beware of Technology Hype for the Automotive Market

As packaging practitioners/experts themselves, regular readers know that IFTLE is always on the lookout for the latest applications and the latest chips going into those applications because all those chips will have to be packaged. However, IFTLE has previously warned the reader to beware of technology hype, which appears to be increasing exponentially throughout the decades that I have lived. As... »

ECTC 2019 Will Go Back to Basics to Plan for the Future of Microelectronics and Packaging

ECTC 2019 Will Go Back to Basics to Plan for the Future of Microelectronics and Packaging

Whoa! Where did the time go? ECTC 2019 is only three weeks away and I haven’t written my annual preview post! This year’s event takes place at the Cosmopolitan in Las Vegas, from May 28-31. I’m excited to announce that my good friend and SemiSister, Nancy Stoffel, General Electric Research is this year’s General Chair. I’d tell you about our escapades the last time ECTC was in Las Vegas.... »

ITFLE 412: Samsung Discusses Packaging for the 4th Industrial Revolution; Yole looks at Non-TSV Options

ITFLE 412: Samsung Discusses Packaging for the 4th Industrial Revolution; Yole looks at Non-TSV Options

At the recent IMAPS Device Packaging Conference in Fountain Hills, AZ. Kyung Suk (Dan) Oh, Package Development VP at Samsung, discussed “Electronics Packaging Technologies for the 4th Industrial Revolution” Oh explained that Samsung sees today’s technology paradigm shift as going “beyond Moore” by a convergence of system integration/packaging and software. Based on the slide below, Oh sa... »

Be a Champion for Change – Highlights from the First SEMI Diversity and Inclusion Forum

Be a Champion for Change – Highlights from the First SEMI Diversity and Inclusion Forum

Everyone found their seat as SEMI President and CEO, Ajit Manocha, took the stage to kick off the first SEMI Diversity and Inclusion Forum. Ajit has a lifelong passion for diversity and inclusion. He shared his backstory and the importance of these initiatives to a room full of executives and Human Resources professionals from across the electronics manufacturing industry. Teamwork Makes the Dream... »

TSMC’s 2019 Technology Symposium highlights 25 Years of Innovation

TSMC’s 2019 Technology Symposium highlights 25 Years of Innovation

In 1994 TSMC, a small wafer foundry from Taiwan held its first Technology Symposium. Since 1999 I have had the privilege to work with TSMC and closely follow their success in building a powerful and cost-effective ecosystem for the fabless IC vendors and foundry business model. To measure their success in hard numbers, please check IC Insights’ 2018 revenue estimates here and see that TSMC has a... »