Archives May 2019 - 3D InCites

TechSearch International Analysis Predicts Growth for Fan-in WLP and FO-WLP

TechSearch International Analysis Predicts Growth for Fan-in WLP and FO-WLP

TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fan-out WLPs (FO-WLPs).  Despite lower growth for smartphones, growth continues as the number of WLPs per handset increase. WLPs are increasingly adopted in tablets, and wearable devices such as smartwatches, fitness bands, and virtual reality headsets. Fan-in WLPs are projected to grow at an 8.5% CA... »

Book Review: Handbook of 3D Integration – Volume 4

Book Review: Handbook of 3D Integration – Volume 4

An essential part of successfully introducing a new technology is to educate engineers and managers on its benefits and tradeoffs. That’s why Wiley started publishing the Handbook of 3D Integration Series with Volume 1 and 2 in 2008, followed by Volume 3 in 2014. This blog covers Volume 4, introduced in early May 2019. It focuses on three important 3D challenges: IC design, test, and thermal man... »

IFTLE 414: Lester the Lightbulb… Revisited 

IFTLE 414: Lester the Lightbulb… Revisited 

In the past few weeks, a reader sent a message to IFTLE titled “Time to bring back Lester the Lightbulb” with a link to a story in the Detroit News. Way back in Aug of 2011, I was covering the forced introduction of light-emitting diode (LED) light bulbs into the US consumer market. Although incandescent light bulbs have nothing to do with advanced heterogeneous integration packaging, the newe... »

EV Group Wafer Bonding Solutions for Heterogeneous Integration and Wafer-Level Packaging to be Highlighted at ECTC 2019

EV Group Wafer Bonding Solutions for Heterogeneous Integration and Wafer-Level Packaging to be Highlighted at ECTC 2019

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that new developments in heterogeneous integration and wafer-level packaging enabled by its advanced wafer bonding solutions will be highlighted in several papers being presented at the 2019 IEEE 69th Electronic Components and Technology Conference (... »

Material Value: A Narrative About More Sustainable, Less Wasteful Manufacturing

Material Value: A Narrative About More Sustainable, Less Wasteful Manufacturing

While I’m only four chapters into Material Value written by my colleague and SemiSister, Julia Goldstein, I decided to write the review before I finish reading the book, because Julia will be at ECTC next week in Las Vegas, and I want you all to be able to read the review before so that you can buy her book at the 3D InCites table and talk to her about it. And then we can talk about it in a virt... »

Women in Semiconductors: A Rising Tide Will Lift All Boats

Women in Semiconductors: A Rising Tide Will Lift All Boats

Like most career women, balancing work and family life is a juggling act, leaving precious little time for hobbies. However, I’ve recently acquired quite a knack for managing NFL fantasy football teams. Despite being a first-time fantasy football manager and the only woman on the team, I was thrilled to win the championship at my workplace! In fantasy football, we assemble a virtual team of play... »

A Non-Techie SemiSister Tackles The Elusive Semiconductor Language

A Non-Techie SemiSister Tackles The Elusive Semiconductor Language

Not all SemiSisters are engineers. In fact, many of us joined this industry from a variety of career backgrounds with non-STEM educations including financial, business management, market research, marketing communications, journalism, and even liberal arts. For us, one of the greatest hurdles to overcome was learning a whole new lexicon of terms that get tossed about every day. In this humorous po... »

Trymax Receives Multi-System Orders from a Top Ten OSAT

Trymax Receives Multi-System Orders from a Top Ten OSAT

NIJMEGEN, THE NETHERLANDS – May 15, 2019. Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions, today announced it has received multi-system orders for its NEO 2000 and NEO 3000 series from a top ten OSAT based in Taiwan. This order will expand the existing NEO install base at the customer in Taiwan and allows Trymax to break into the customer’s fab in China. Shi... »

3D Test: No Longer a Bottleneck!

3D Test: No Longer a Bottleneck!

When I joined imec in October 2008 to work on test and design- for- test (DfT) of 3D-stacked integrated circuits (ICs), there were only a few test folks active in that emerging field. Consequently, misconceptions about 3D test were omnipresent. In the November 18, 2008 issue of Semiconductor International, Alexander Braun wrote: “At a symposium yesterday on 3-D integration, leading expert Philip... »

U2U 2019 Conference Dives into 2.5/3D IC Design

U2U 2019 Conference Dives into 2.5/3D IC Design

Key advanced packaging technology influencers came out in force to discuss the status of  EDA tools for 2.5D/3D IC package design at the recent User to User (U2U 2019) Conference, organized by Mentor, A Siemens’ Business and hosted at the Santa Clara Marriott. Presenters from Wave Computing, ARM, Amkor, TechSearch International Inc., and Qualcomm lent their voices to the cause. Technology T... »

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