Archives April 2019 - 3D InCites

Book Review: Advances in Embedded and Fan-out Wafer Level Packaging Technology

Book Review: Advances in Embedded and Fan-out Wafer Level Packaging Technology

When asked by Beth Keser and Steffen Krönert to review their new book, Advances in Embedded and Fan-out Wafer Level Packaging Technology, I was a little apprehensive. I reminded them that I was NOT an engineer, so would only be able to review it from the layperson’s perspective. They assured me that was precisely what they were looking for, so I agreed. Written by Experts When the book arrived ... »

IFTLE 411: Focus on the Sensor Technology Market

IFTLE 411: Focus on the Sensor Technology Market

At the recent IMAPS Device Packaging Conference, March 5-7, 2019 in Fountain Hills AZ, Benedetto Vigna, president of the ST Micro Analog, MEMS and Sensors Group, discussed the company’s presence in the sensor technology market. The vast assortment of sensor and actuator functions have recently been defined by Yole Developpement as shown in Figure 1. 2018 IHS market data shows >50% of the ... »

SemiSister Success Stories: Lena Nicolaides Turns Adversity into Opportunity

SemiSister Success Stories: Lena Nicolaides Turns Adversity into Opportunity

I first met Lena Nicolaides on a tour of KLA’s manufacturing area in 2015, just before the launch of the CIRCL™-AP. She had recently been promoted to vice president and general manager of the company’s LS-SWIFT Division. We spent some time picking each other’s brains about the industry and where advanced packaging was going, and I immediately felt a kinship. I knew she was a SemiSister. Th... »

Could ON Semiconductor be GlobalFoundries’ White Knight?

Could ON Semiconductor be GlobalFoundries’ White Knight?

In light of recent rumors, could ON Semiconductor’s acquisition of GlobalFoundries’ East Fishkill fab save the company from being carved up further? The Basics Phoenix, AZ-based ON Semiconductor (ON Semi) announced its second big acquisition in the past month: the purchase of GlobalFoundries’ (GF) East Fishkill 300mm semiconductor fab. The first was the acquisition of WiFi technology... »

Advanced Heterogeneous Packaging Solutions for High Performance Computing

Advanced Heterogeneous Packaging Solutions for High Performance Computing

Heterogeneous integrated circuit (IC) packaging has made a full entrance into the high-performance computing arena. The target applications are broad, running the gamut from artificial intelligence (AI), deep learning, data center networking, supercomputers, and autonomous driving. In fact, a new generation of deep learning AI, leading central processing units (CPUs) for data center servers as wel... »

Update on  3D X-ray and DBI Technology for Advanced and 3D Packaging

Update on 3D X-ray and DBI Technology for Advanced and 3D Packaging

The Microelectronics Packaging & Test Engineering Council (MEPTEC) held its monthly meeting at SEMI in Milpitas on April 10.  Two speakers outlined their companies’ capabilities and demonstrated their own expertise in solving specific industry challenges. Tom Gregorich presented why and how Zeiss supports IC package inspection with 3D X-ray machines, then Sitaram Arkalgud conveyed the benef... »

IFTLE 410: ST Microelectronics Bets on SiC; A Look at Power Device Packaging

IFTLE 410: ST Microelectronics Bets on SiC; A Look at Power Device Packaging

Silicon Carbide (SiC) is a wide bandgap (WBG) material that has advantages when compared to silicon (Figure 1).  For the same die size and thickness, WBG devices provide higher breakdown voltage, current, operating temperature, and switching speed; and lower switching loss over Si devices.  ST Microelectronics (ST Micro) started working with SiC in 1996, producing its first SiC diodes in 2004. I... »

Reliable Process Control Solutions for the Growing Power Device Market

Reliable Process Control Solutions for the Growing Power Device Market

The expected increase of the power device market, with a compound annual growth rate (CAGR) of more than 10% — and more particularly insulated-gate bipolar transistor (IGBT) products for automotive and other applications — is pushing the semiconductor industry to adopt specific process solutions. The maturity of IGBT market, boosted by booming demand for electrified vehicles (EV) and hybrid el... »

Addressing the Challenges of Surface Preparation for Advanced Wafer Level Packaging

Addressing the Challenges of Surface Preparation for Advanced Wafer Level Packaging

The importance of surface preparation and wafer cleans during semiconductor device manufacturing is migrating from front-end wafer processing to back-end wafer level packaging processes. To get a clearer picture of how this impacts semiconductor equipment and materials suppliers, 3DInCites spoke with Anil Vijayendran, vice president of marketing at Veeco Instruments, Precision Surface Processing D... »

IFTLE 409: ST Micro Studies Hybrid Bonding Reliability; TSMC 2019 Packaging Revenue

IFTLE 409: ST Micro Studies Hybrid Bonding Reliability; TSMC 2019 Packaging Revenue

Continuing our look at the 2019 SEMI 3D and Systems summit in Dresden, we look at presentations on advanced packaging platforms and hybrid bonding reliability. Systems Plus Romain Fraux of System Plus discussed their analysis of the latest advanced packaging platforms on the market. The Yole Développement quantitative analysis of the market is shown in Figure 1: They offered the comparison slide ... »

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