Archives March 2019 - Page 2 of 2 - 3D InCites

EV Group and Panasonic Team Up on Resist Processing Solution for Plasma Dicing

EV Group and Panasonic Team Up on Resist Processing Solution for Plasma Dicing

EV Group (EVG) and Panasonic Smart Factory Solutions Co., Ltd. announced today that both companies have teamed up to provide a novel resist processing solution for plasma dicing that is developed for emerging applications, such as Internet of Things (IoT) sensors, MEMS, RFID, CMOS image sensors and thinned memories. This advanced solution, which incorporates the EVG®100 series of resist processin... »

Heterogenous Integration’s Star Rises at the 15th Annual IMAPS Device Packaging Conference

Heterogenous Integration’s Star Rises at the 15th Annual IMAPS Device Packaging Conference

Remember when device node scaling was the semiconductor superstar, and advanced packaging was the back-up singer? At the 15th Annual IMAPS Device Packaging Conference, held March 5-7, 2019, in Fountain Hills, AZ, it became clear how rapidly that hierarchy has shifted. From the keynotes to the panel discussion, to the Global Business Council session, speakers portrayed heterogenous integration (HI)... »

IFTLE 406: Rumors about GlobalFoundries; TSMC’s $0.5B Resist Mishap; Bridg

IFTLE 406: Rumors about GlobalFoundries; TSMC’s $0.5B Resist Mishap; Bridg

In this post, we interrupt our regularly scheduled conference review to look at some items that should be of interest to us all. Is GlobalFoundries (GF) Up for Sale? GlobalFoundries is currently the 3rd largest semiconductor foundry supplier with a reported 8.4% market share, just behind TSMC and Samsung. It has five 200 mm wafer fabrication plants in Singapore, one 300 mm plant each in Germany an... »

Heterogeneous Integration Drives New Package Developments

Heterogeneous Integration Drives New Package Developments

The high cost of moving to the next semiconductor technology node is changing the role of packaging and assembly in the electronics industry. Heterogeneous integration has become the solution to achieve the economic advantages that were previously met with silicon scaling. TechSearch International’s new report describes these packaging options, including silicon interposers, fan-out-on-substrate... »

SkyWater Chooses Veeco Wet Processer for 3DSoC Collaboration with MIT

SkyWater Chooses Veeco Wet Processer for 3DSoC Collaboration with MIT

PLAINVIEW, N.Y., Feb. 28, 2019—Veeco Instruments Inc. (NASDAQ: VECO) today announced that SkyWater Technology Foundry has taken delivery of the WaferStorm® single wafer wet process system to support advanced development work for the design and fabrication of next-generation 3D monolithic System-on-a-Chip (3DSoC) technology. One of the most advanced U.S.-based semiconductor technology foundries,... »

The First Decade: A Message from the Queen of 3D

The First Decade: A Message from the Queen of 3D

Has it already been 10 years since my first business partner, Leo Archer, and I started 3D InCites? When we first conceived of the idea in 2009, I had no idea what I was getting myself into or that 10 years later, 3D InCItes would be so well recognized in the industry, and that I would be known as the Queen of 3D. Leo and I parted ways in 2011, and after a year of going it alone and seriously thin... »

A Race to the Finish: Announcing the Winners of the 2019 3D InCites Awards

A Race to the Finish: Announcing the Winners of the 2019 3D InCites Awards

The 2019 3D InCites Awards vote was a nail-biter right up until the end.  While some categories seemed almost predictable from start, others were neck-and-neck, with the front runner changing on a daily basis. What was most exciting to me, however, was how many new participants we had, and how well they did. So, from almost-to-close-call to we-never-saw-that-one-coming, here’s my analysis of th... »

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