IFTLE 401: FOWLP for RF; D2W Hybrid Bonding; FOPLP in Samsung Watch

As its name implies, the International Wafer Level Packaging Conference (IWLPC) initially covered wafer-level packaging (WLP) technologies. As all conferences do, it soon expanded its scope to cover basically all advanced packaging topics including WLP, fan-out wafer-level packaging (FOWLP), 2.5D/3D, and advanced manufacturing and test, etc. Statistics from this year’s show include: 809 Attendees 75 … Continue reading IFTLE 401: FOWLP for RF; D2W Hybrid Bonding; FOPLP in Samsung Watch