Archives December 2018 - Page 2 of 2 - 3D InCites

EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic microLED Technology for AR Applications

EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic microLED Technology for AR Applications

Plessey, a leading developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, to bring high-performance GaN-on-Silicon (GaN-on-Si) monolithic microLED technology to the mass market. microLEDs are the key optical technology for nex... »

Innovations for High Performance Microelectronics Cooperates with EV Group on Low-Temp Covalent Wafer Bonding Technologies

Innovations for High Performance Microelectronics Cooperates with EV Group on Low-Temp Covalent Wafer Bonding Technologies

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that IHP – Innovations for High-Performance Microelectronics (IHP), a German research institute for silicon-based systems, highest-frequency integrated circuits, and technologies for wireless and broadband communication, has purchased an EVG® ... »

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