Archives December 2018 - 3D InCites

How Do We Improve Gender Diversity and Inclusion in the Semiconductor Industry?

How Do We Improve Gender Diversity and Inclusion in the Semiconductor Industry?

In 2018, gender diversity and inclusion (D&I) ranked right up there with artificial intelligence, autonomous cars, and panel-level packaging as a hot-button topic for panel discussions at most of the semiconductor industry and advanced packaging events I attended (as well as those I didn’t). ECTC 2018 featured its annual women’s panel and reception, and IMAPS International hosted an inform... »

Happy Holidays, from all the elves at 3D InCites!

Happy Holidays, from all the elves at 3D InCites!

The semiconductor industry could learn a few things from Santa’s elves. How about devices that package themselves? These guys may be onto something. Check it out. »

Polymeric Materials: Massive Adoption by the Advanced Packaging Industry

Polymeric Materials: Massive Adoption by the Advanced Packaging Industry

According to the market research and strategy consulting company, Yole Développement (Yole), the polymeric materials market revenue will double over the next five years. Driven by movements towards further miniaturization and higher functionalities, megatrend applications like artificial intelligence (AI), 5G, and augmented/virtual reality (AR/VR) are creating huge business opportunities. Therefo... »

Advanced Packaging Technologies are Key for Semiconductor Innovation

Advanced Packaging Technologies are Key for Semiconductor Innovation

“2017 was an unprecedented year for semiconductor industry”, comments Santosh Kumar, Director of Packaging, Assembly, and Substrates at Yole Korea, part of Yole Développement (Yole).“The market grew by 21.6% year-to-year to reach a record of almost US$412 billion.” Under this dynamic context, the advanced packaging industry is playing a key role, offering huge opportunities for innov... »

Implementing High-Density Advanced Packaging for OSATs and Foundries

Implementing High-Density Advanced Packaging for OSATs and Foundries

Moore’s law is increasingly difficult to maintain and is driving the growth of innovative, high-density advanced packaging technologies in response to system scaling demands. These innovations are increasingly in the form of fan-out wafer level packaging (FOWLP) or multi-substrate / multi-device packages like interposers and system-in-package (SiP). New challenges come with these disruptive tech... »

Rudolph’s NovusEdge Selected by Leading Wafer Manufacturers for Bare Wafer Edge and Backside Inspection

Rudolph’s NovusEdge Selected by Leading Wafer Manufacturers for Bare Wafer Edge and Backside Inspection

Wilmington, Mass. (12/11/2018)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced the receipt of over $12M in new orders for its recently-released NovusEdge™ system for edge and backside inspection on bare silicon wafers. The new orders are for capacity expansions at our existing customers as well as orders from two additional large wafer manufacturers based in Asia. These orders are in... »

IFTLE 400: Intel Logic-Logic 3DIC and Chiplets are Finally Here

IFTLE 400: Intel Logic-Logic 3DIC and Chiplets are Finally Here

At the Intel “architecture day” held Dec 12th in Santa Clara, Intel finally announced what some of us have been waiting for, literally for over a decade. The Foveros Backstory In late 2006, CEO Paul Otellini displayed a 300mm wafer of 80 core microprocessors (Figure 1) and announced that such technology would soon be in production. In 2007 Bryan Black (later of AMD), Morrow and other Intel res... »

Replacing NMP: Are You Ready?

Replacing NMP: Are You Ready?

NMP is an abbreviation for N-methyl-2-pyrrolidone (other synonyms are 1-Methyl-2-pyrrolidone and 1-Methyl-2-pyrrolidinone) (Figure 1). NMP has proven itself as an effective and versatile cleaning agent, removing photoresist residue while leaving the surface in good shape for processing steps downstream. However, its time may be short-lived as companies strive to meet environmental health and safet... »

TechSearch International Explores Power Device Packaging and Assembly Trends

TechSearch International Explores Power Device Packaging and Assembly Trends

Power devices are experiencing growth driven by demand in a variety of areas. TechSearch International projects a 4.3% growth in overall leadframe package shipments from 2017 to 2021 for power device packaging, with stronger growth projected for Cu clip packages. Applications including energy generation and infrastructure, electric and hybrid vehicles, electric vehicle charging, data centers, indu... »

EV Group Unveils Next-Gen Fusion Wafer Bonder for “More Moore” Scaling and Front-End Processing

EV Group Unveils Next-Gen Fusion Wafer Bonder for “More Moore” Scaling and Front-End Processing

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the all-new BONDSCALE™ automated production fusion bonding system. BONDSCALE is designed to fulfill a wide range of fusion/molecular wafer bonding applications, including engineered substrate manufacturing and 3D integration approaches that use la... »

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