Archives November 2018 - 3D InCites

IFTLE 399: Polymer Dielectric Updates from HD Micro, Taiyo Ink, Toray and MicroChem

IFTLE 399: Polymer Dielectric Updates from HD Micro, Taiyo Ink, Toray and MicroChem

Who was Madeline on Halloween? Before we start more tech coverage of IMAPS 2018 with a look at polymer dielectric advancements, long time readers know that you are due a Halloween update on my granddaughters. This year I’m focusing on Madeline who will be eleven in February. Her Halloween disguise this year was from her favorite Netflix TV show. Can you guess the character and the show??  I hav... »

Seen on the Scene at Electronica 2018

Seen on the Scene at Electronica 2018

This was my first Electronica, and all I can say is – It is massive. It covered everything to do with the electronics supply chain, from chip design to the chip itself, to the package, component, subassembly, circuit board, through to test and measurement, and enclosures, switches, the works. While my focus for this trip was SEMICON Europa, I took the long way to hall A4, wandering through the E... »

Seen on the Scene at SEMICON Europa 2018

Seen on the Scene at SEMICON Europa 2018

SEMICON Europa was an island in the vast sea of Electronica. It occupied one hall out of 18. But without that hall full of equipment, process, and material suppliers, the other 17 wouldn’t have any reason to exist. Think about that for a bit. There’s a reason “Semiconductors drive smart” was SEMI’s chosen theme for the event.  Rather than attend all the sessions in the tech arena, I cho... »

Designing and Integrating MCM/SIP Packages into Systems PCBs

Designing and Integrating MCM/SIP Packages into Systems PCBs

The challenge of designing smaller, cost-effective systems that require additional processing and performance power led to 3D chip stacking of bare die and a new approach to packaging known as SiP (systems-in-package), also known as multi-chip modules (MCMs). The benefits of MCM/SiP package technology include the ability to achieve greater functionality in a reduced time-to-market window that cann... »

Closing Out My 2018 Conference Season With SEMICON Europa and Electronica

Closing Out My 2018 Conference Season With SEMICON Europa and Electronica

In the past 10 weeks, I’ve attended five conferences: two in Europe, and three in California. Two focused on MEMS and sensors, two on advanced packaging, and one that tied everything all together. At all of these events, the themes were consistent: advanced packaging rules; automotive and IoT is driving the train, and artificial intelligence and machine learning are the ones to watch on the hype... »

IFTLE 398: Samsung’s 256Gb 3DS (TSV-Stacked) RDIMM; IMAPS 2018 in Pasadena

IFTLE 398: Samsung’s 256Gb 3DS (TSV-Stacked) RDIMM; IMAPS 2018 in Pasadena

Samsung at the Leading Edge At the recent Samsung Tech Day, the company unveiled several new technologies: Their 7nm extreme ultraviolet (EUV) process node from Samsung’s foundry business SmartSSD – a field programmable gate array (FPGA) SSD, that will offer accelerated data processing and the ability to bypass server CPU limits QLC-SSD for enterprise and data centers that offer 33%t more... »

UnitySC Unveils New Inspection System for the Advanced Packaging and Wafer Processing Ecosystem

UnitySC Unveils New Inspection System for the Advanced Packaging and Wafer Processing Ecosystem

Grenoble, France (November 8, 2018)— UnitySC European leader and a key player in inspection and metrology solutions, today launched the Unity_LIGHTiX ™ system for micro/macro all surface inspection and 2D/3D metrology. This new inspection and metrology system has been designed to address multiple applications including redistribution layers (RDL) down to 2/2 µm line/space, as well as µbump i... »

MRSI Announces HVM3 Die Bonding Demonstration Capability in Shenzhen China

MRSI Announces HVM3 Die Bonding Demonstration Capability in Shenzhen China

STOCKHOLM, Nov 9, 2018 — MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district, Shenzhen, China. MRSI will be offering local demonstrations of its market-leading MRSI-HVM3 die bonder and also die bonding applications using customer’s sample materials, by arrangement. Thi... »

EDA Design Tools/Flows Targeting WLP Featured at IWLPC 2018

EDA Design Tools/Flows Targeting WLP Featured at IWLPC 2018

Wafer and panel-level packaging (WLP/PLP) offers technical and business advantages, compared to traditional IC packages. These cost-effective packaging solutions attracted more than 800 industry experts to the International Wafer Level Packaging Conference (IWLPC 2018) in San Jose’s DoubleTree Hotel at the end of October. In case you were wondering, a multi-die WLP design, created with the tools... »

Trymax Turns 15 and Celebrates Success at SEMICON Europa 2018

Trymax Turns 15 and Celebrates Success at SEMICON Europa 2018

NIJMEGEN, THE NETHERLANDS – November 08, 2018. Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions for semiconductor manufacturers, has reached a milestone this month celebrating 15 years of business. As a testimonial of its success, the company recently won the entrepreneurial prize from the Dutch financial institution FD Gazellen(1). “We have come a long way s... »

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