Archives September 2018 - 3D InCites

Will Fully-Autonomous Vehicles Ever Take Over Our Roads?

Will Fully-Autonomous Vehicles Ever Take Over Our Roads?

At the 2018 European MEMS, Imaging and Sensors Summits, I detected a shift in sentiment around the likelihood (and the feasibility) that fully-autonomous vehicles are poised to take to the roads in the next two years. In reality, fully-autonomous vehicles won’t be rolling off the assembly lines any time soon, if ever. The readiness of sensor systems and the high cost of manufacturing these cars ... »

MEMS, Imaging, and Sensors Summits Show The Power of Collaboration

MEMS, Imaging, and Sensors Summits Show The Power of Collaboration

Last week, at the co-located 2018 European MEMS and Sensors/Imaging and Sensors Summits, held in Grenoble, France, I had the pleasure of gathering with 380 attendees from 21 companies from around the world to discuss the latest trends and technologies in MEMS, imaging, and sensors. Topics of discussion included the latest MEMS, imaging, and sensor market trends; application spaces such as automoti... »

Why Today’s Advanced Packages Need Better Inspection and What’s Being Done About It

Why Today’s Advanced Packages Need Better Inspection and What’s Being Done About It

It’s almost ironic. As CMOS scaling (aka: Moore’s Law) has slowed due to the increased complexity and cost of achieving smaller nodes, the focus has shifted to advanced packaging and heterogeneous integration to meet demands for microelectronics devices targeting the internet of things (IoT) market. These devices perform a variety of functions (sensing, processing, remembering, transmitting) i... »

Veeco Announces Changes to Executive Leadership Team

Veeco Announces Changes to Executive Leadership Team

PLAINVIEW, N.Y., September 4, 2018 —Veeco Instruments Inc. (NASDAQ: VECO) today announced that John Peeler, Chairman, and Chief Executive Officer, will transition to the role of Executive Chairman, effective October 1, 2018.  William J. Miller, currently President, will become Chief Executive Officer and will join the Company’s board of directors bringing the size of the board to eight.  Add... »

Brewer Science Unveils Dual-Layer Temporary Bonding System and Material for RDL-first Fan-Out Packaging

Brewer Science Unveils Dual-Layer Temporary Bonding System and Material for RDL-first Fan-Out Packaging

Rolla, Missouri – Sept. 4, 2018 – Brewer Science, Inc. today from SEMICON Taiwan introduced the latest additions to its industry-leading BrewerBOND® family of temporary bonding materials, as well as the first product in its new BrewerBUILD™ line of thin spin-on packaging materials. BrewerBUILD delivers an industry-first solution to address manufacturers’ evolving wafer-level packaging cha... »

Package Designers Need Assembly-level LVS Signoff for HDAP Verification

Package Designers Need Assembly-level LVS Signoff for HDAP Verification

While advanced IC packaging is a fast-growing market, comprehensive package verification still has a ways to go. Unique package connectivity issues, such as missing or misplaced interposer/package bumps/pads, pin naming and text labeling issues, and the like, require new and enhanced layout vs. schematic (LVS)-like verification techniques that can move across the entire package to ensure proper co... »