Archives August 2018 - 3D InCites

Rudolph Technologies Launches Second-Generation Dragonfly Inspection and Metrology System for Advanced Packaging

Rudolph Technologies Launches Second-Generation Dragonfly Inspection and Metrology System for Advanced Packaging

Wilmington, Mass. (August 29, 2018)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced its new Dragonfly™ G2 platform, which incorporates many of the benefits of the Firefly™ system onto the Dragonfly platform, including higher sensitivity and throughput and the proprietary Clearfind™ Technology. The new system increases the options for advanced packaging customers to meet their wafe... »

Research Scientist, Maaike M. Visser Taklo, Rises to Her Own Challenge

Research Scientist, Maaike M. Visser Taklo, Rises to Her Own Challenge

Throughout my years of writing about the semiconductor industry, I’ve met women from all over the world. I’ve often wondered what or who encouraged them to pursue careers in this male-centric environment? How much of their motivation is inspired by the culture of where they grew up?  Can success be quantified? The answers are as varied as the women whose stories we want to tell. Our goal with... »

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MRSI’s MRSI-H3TO Die Bonding Product Family Supports the 5G Wireless Network Supply Chain

MRSI Systems (Mycronic Group) is launching the MRSI-H3TO, a new 3μm high speed die bonder which will be the first of its kind to address the multi-die and multi-process requirements, delivering industry-leading throughput, superior flexibility, and future-proven 3μm placement accuracy. The MRSI-H3TO is tailored for WDM/EML-TO or other multi-die multi-processing TO-can photonic devices to support... »

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MRSI Targets MRSI-H3LD Die Bonder For The High Power Diode Laser Market

MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3μm high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced photonics such as industrial lasers, optical fiber amplification, lighting, and sensors. High power diode lasers are critical components for multiple markets and have seen a significant, continual rise in adoption with ... »

Diversification of Markets Calls for Hybrid Metrology with Multi-Sensor Technology

Diversification of Markets Calls for Hybrid Metrology with Multi-Sensor Technology

It used to be that people thought about metrology for front-end process control and inspection for advanced packaging. As wafer level packaging (WLP) and heterogeneous integration (HI) approaches became more advanced, metrology processes began creeping into back-end process control, where measurement becomes trickier and more diversified. As part of the 3D InCites Award Winners series, I spoke wit... »

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MRSI Systems’ MRSI-HVM3P Extends The MRS-HVM3 Die Bonder Family to New Applications

BILLERICA, Massachusetts, USA, August 20, 2018 – MRSI Systems (Mycronic Group), is expanding its leading high-speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer configurations for active optical cable (AOC), gold-box packaging, and other applications in addition to chip-on-carrier (CoC). This expansion is in response to our customer’s request to take advantage of t... »

Tips for Navigating the European MEMS and Sensors/Imaging and Sensors Summits

Tips for Navigating the European MEMS and Sensors/Imaging and Sensors Summits

For the second consecutive year, SEMI Europe is co-locating its MEMS and Sensors/Imaging and Sensors Summits in Grenoble, France, in the heart of the Rhone-Alpes. Rather than Minatec Campus, where the event was held last year, both summits will take place at The World Trade Center Grenoble. After last year’s successful and information-packed event, I’m looking forward to attending this year’... »

How Jessica Gomez Short-Circuited Her Way to CEO: A SemiSister Success Story

How Jessica Gomez Short-Circuited Her Way to CEO: A SemiSister Success Story

The number is sobering: according to the U.S. Bureau of Labor of Statistics, 16.9% of chemical engineers and 12.3% of electrical/electronics engineers in the US are women. For racial diversity, the situation is even worse. These grave statistics came to light during a recent panel discussion during SEMICON West, in its Workforce Pavilion. Here, Jessica Gomez, co-founder and CEO of Rogue Valley Mic... »

Perspectives on the Cost of Fan-out Wafer Level Packaging vs. Flip Chip Packaging

Perspectives on the Cost of Fan-out Wafer Level Packaging vs. Flip Chip Packaging

Recently, I read a paper published in the 2017 IMAPS Device Packaging Conference proceedings, titled “Cost Comparison of Fan-out Wafer Level Packaging and Flip Chip Packaging,” written by Amy Lujan, of Savansys. Lujan did a very good analysis on the cost comparison of fan-out wafer-level packaging (FOWLP)  with chip-first and die face-down and flip chip (FC) packaging, according to a... »

TechSearch International Analyzes Trends in Packages for AI Applications

TechSearch International Analyzes Trends in Packages for AI Applications

Artificial Intelligence (AI) combines both hardware and software.  TechSearch International’s latest analysis explains the packages behind AI applications. AI accelerators found in datacenters require high-density packages to support logic plus high bandwidth memory (HBM). Many silicon interposer designs are in mass production and Intel’s EMIB is also used.  Package-on-package (PoP) is use... »

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