Archives May 2018 - 3D InCites

EV Group Secures Lithography Order from VTT Technical Research Centre for “More than Moore” Applications

EV Group Secures Lithography Order from VTT Technical Research Centre for “More than Moore” Applications

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has received an order for its EVG®120 automated resist processing system from VTT Technical Research Centre of Finland (VTT). An existing customer of EVG’s wafer bonding and alignment systems, VTT is among the first to place an order for t... »

Thermal Metamaterials for Advanced Packaging Applications from Stanford University

Thermal Metamaterials for Advanced Packaging Applications from Stanford University

Dense materials that exhibit high thermal conductivity are abundant in nature: think copper, think diamond, think silicon. And porous materials with low thermal conductivity also exist, or are easily fabricated: think polyimide, for example, or think of the various porous xerogels. But dense materials that are also thermal insulators, or porous materials that are good thermal conductors? Those are... »

UnitySC Opens New Asia Entity to Support Advanced Packaging and Power Device Markets

UnitySC Opens New Asia Entity to Support Advanced Packaging and Power Device Markets

Hsinchu, Taiwan – May 8, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced the opening of its Asia subsidiary, Unity Semiconductor Limited Company (UnitySC Asia). The entity was established to deliver enhanced customer support for UnitySC’s growing installed base of inspection and metrology tools throughout the region. UnitySC Asia is headquartered at T... »

bitcoin

Bitcoin and Beanie Babies: Why Cryptocurrency Volatility Matters to the Semiconductor Industry

Bitcoin, a cryptocurrency built on blockchain, has become one of the hottest topics to hit the semiconductor news feeds and the conference circuit since the iPhone. Why? Because this code-based technology requires so much compute power to run complex mathematical equations that it gobbles up more energy than is required to fuel the entire country of Denmark. In fact, a recent article in the Washin... »

EV Group Begins Construction of New Manufacturing III Building to Expand Production Capacity

EV Group Begins Construction of New Manufacturing III Building to Expand Production Capacity

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has started construction work for the next expansion phase of its corporate headquarters. The new, state-of-the-art building will house EVG’s “Manufacturing III” facility, which will more than double the floor space for the final assemb... »

2018 TSMC Technology Symposium: Listen – Analyze – Act

2018 TSMC Technology Symposium: Listen – Analyze – Act

May 1st is a holiday in many countries, but not in the U.S. and not for TSMC. A very professional TSMC team and many of its Open Innovation partners demonstrated recent accomplishments to a gathering of more than 2000 attendees at the 2018 TSMC Technology Symposium at the Santa Clara Convention Center. TSMC’s strategy to listen to market needs, analyze how best to meet the requirements and act a... »

Beyond the Smartphone: How Digital Imaging is Becoming Ubiquitous 


Beyond the Smartphone: How Digital Imaging is Becoming Ubiquitous 


Digital imaging has come a long way since its first consumer implementation in digital cameras to replaced film cameras in the early 21st century. In fact, digital imaging technologies have become so varied and advanced thanks to CMOS image sensor technology, integrated circuits (ICs), and advanced packaging that almost anything can have camera capabilities integrated into it. As part of our 3D In... »