Archives January 2018 - 3D InCites

A Material Solution for the Growing 3D Imaging Market

A Material Solution for the Growing 3D Imaging Market

With emerging markets developing for augmented reality (AR), virtual reality (VR), facial-recognition security systems, advanced human/machine interfaces and other 3D imaging applications, the need for 3D camera systems is booming. These 3D cameras require CMOS image sensors that are capable of working in the near-infrared (NIR) spectrum. In 2018, a towering wave of 3D imaging and sensing products... »

Rudolph Technologies Expands Memory Customer Base with  $21 Million in System Orders

Rudolph Technologies Expands Memory Customer Base with $21 Million in System Orders

Wilmington, Mass. (January 16, 2018)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received over $21 million (USD) in orders for process control solutions for memory applications from two customers: a Korean-based manufacturer of advanced DRAM ranking in the top five of worldwide semiconductor companies and a rapidly expanding 3D NAND manufacturer in China. The orders, whic... »

aveni® S.A. Announces Breakthrough Electrical Yield Results for 12:1 Aspect Ratio TSVs

aveni® S.A. Announces Breakthrough Electrical Yield Results for 12:1 Aspect Ratio TSVs

MASSY, France – Jan. 23, 2018 – aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for 3D through silicon via (TSV) packaging and 2D interconnects, today announced that CEA-Leti has successfully fabricated TSVs at an unprecedented 12:1 aspect ratio and achieved 100% electrical yield using aveni’s Rhea copper seed. This study used 12:1 aspe... »

Living the Dream at SEMI’s Industry Strategy Symposium

Living the Dream at SEMI’s Industry Strategy Symposium

As I noted in my day one coverage of SEMI’s Industry Strategy Symposium (ISS 2018), which took place last week at the Ritz-Carleton Hotel in Half Moon Bay, CA, this was the first time I’d been invited to join the industry elite as a member of the press* at this most coveted annual event. In this role, I was made privy to the inner workings of what makes the semiconductor industry tick, and the... »

SEMI ISS 2018: AI, IoT, Automotive to Fuel Industry Growth

SEMI ISS 2018: AI, IoT, Automotive to Fuel Industry Growth

HALF MOON BAY, Calif. — January 17, 2018 — The SEMI Industry Strategy Symposium ( SEMI ISS) opened yesterday with the theme “Smart, Intuitive & Connected: Semiconductor Devices Transforming the World.” The annual three-day conference of C-level executives gives the year’s first comprehensive outlook of the global electronics manufacturing industry. Yesterday highlighted market and t... »

Notes from SEMI’s ISS 2018, Days 2 and 3

Notes from SEMI’s ISS 2018, Days 2 and 3

The remaining two days of SEMI’s ISS 2018 dawned foggy and damp, making it a heck of a lot easier to head to the ballroom for a day and half full of inspiring talks versus ditching it all to answer the call of the pounding surf (I grew up on the ocean and now live in the desert, so trust me when I say the temptation was real.) Day Two started with a general technology session kicked off by L... »

Notes from SEMI’s ISS 2018, Day One

Notes from SEMI’s ISS 2018, Day One

SEMI’s Industry Strategy Symposium (ISS) has been on my conference bucket list for some time, so when I was offered a press pass to attend ISS 2018, there was no question about attending. One day in, and I’m not disappointed. The venue, the Ritz Carleton at Half Moon Bay, is spectacular – nothing like falling asleep to the sound of crashing waves on the beach below – and so far, the speake... »

Using Co-Design to Ensure Multi-Fabric System-Design Success

Using Co-Design to Ensure Multi-Fabric System-Design Success

Today’s SoCs, multi-core CPUs and GPUs with their high performance, high bandwidth interconnect interfaces put demanding challenges across the entire system signal path, requiring system-wide optimization for product success. However, although typical system substrate design discipline (chip, packaging, and PCB) have well-developed design approaches, the interaction between them largely remains ... »

The 14th ASIP Addresses a Spectrum of Advanced Packaging Opportunities, Part 2

The 14th ASIP Addresses a Spectrum of Advanced Packaging Opportunities, Part 2

Part 1 of my 3D ASIP blog covered the five keynotes presented at 3D ASIP 2017. Part 2 focuses on more than 20 informative presentations, where focused experts gave an in-depth view of new and/or improved technologies for 3DIC-related advanced packaging. Before we address these, allow me a one-sentence recap of Part 1’s key message: We no longer have one major application, like mainframes, PCs, a... »

2018 Outlook for Advanced Packaging Materials

2018 Outlook for Advanced Packaging Materials

Advanced packaging is moving mainstream as manufacturers continue to seek ways to improve device performance beyond traditional scaling. The semiconductor industry is also witnessing increasing investments in packaging, in terms of capabilities, capacity, and infrastructure from the assembly and packaging houses. All this attention on packaging is primarily driven by the need to deliver highly int... »

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