Sitting in the bus on the way back from Grenoble to Airport Lyon, I am reflecting the last two days during which we honored Gilles Poupon, the Advanced Packaging “Pope” of CEA Leti. Upon his retirement at the end of November 2017, somehow an era ends. I have known Gilles for quite a long time: He reminded of the first time we met. It was 2003 in Munich. Gilles was a member of the CEA delegatio... »
Growth for high-density fan-out wafer level packages (FO-WLPs) continues unabated, with Apple’s continued use of TSMC’s InFO process in its smartphone application processors. Standard FO-WLP has experienced a few bumps on the road to higher volumes this year. Problems with Qualcomm’s steep ramp of FO-WLP for its PMICs and RF transceivers at the end of last year, and board-level reliability c... »
As one of the current key drivers of the semiconductor industry, the development of robots with artificial intelligence has been on my mind quite a bit recently, second only to autonomous vehicles. I am curious to understand why we, as humans, are driven to develop technology that will surpass us in intelligence. While, among other things, AI is predicted to streamline manufacturing, improve medic... »
From the keynotes to the sessions to casual conversation, automotive electronics was a hot topic of discussion at SEMICON Europa 2017. That’s likely because Europe leads the world in automotive OEMs and is home to four of the top 10 semiconductor providers in the automotive industry. With over 22% growth in automotive ICs over the past year, it’s definitely something to talk about. Autonomous ... »
I remember the day I became Queen of 3D like it was yesterday: It was 2007 and I was attending my very first SEMICON Europa, which was held in Stuttgart, Germany. At the time, I was managing editor of Advanced Packaging Magazine, and the hot technology topic was through silicon vias (TSVs) as an emerging technology that would enable 3D chip stacking. Equipment suppliers like SPTS (then STS), EV Gr... »
Munich, Germany, November 14, 2017– Merck, a leading science and technology company, is offering material solutions to the next generation automotive applications. Future automotive requires different features from current electronic devices, such as heat resistance, safety, and longlasting functionality chips. As materials play a key role in the performance and reliability of advanced IC chips,... »
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Leti, an institute of CEA Tech, today announced the world’s first successful 300-mm wafer-to-wafer direct hybrid bonding with pitch dimension connections as small as 1µm (micron). This breakthrough also achieved copper pads as small as 500nm. The copper/oxide... »
It’s been a busy few weeks for me as I attended both the International Wafer Level Packaging Conference (IWLPC), October 24-26, 2017 at the DoubleTree in San Jose and SEMI-MSIG’s MEMS and Sensors Executive Congress, October 31-Nov. 2, at the Hayes Mansion in San Jose. In addition to taking in some great keynotes and technical sessions, I had the opportunity to meet with several companies to fi... »
One of the things I like best about the annual MEMS and Sensors Executive Congress (MSEC17) hosted by SEMI-MSIG, is being in the presence of some of the greatest minds in the industry. While the presentations are always top-notch, it’s the stimulating dinner conversations they inspire that I look forward to most. This year, I decided to leave the straightforward reporting to my journalist collea... »
I’ve often found it somewhat ironic that those responsible for dreaming up and building the technologies that made smart devices, cities, cars, and factories possible, are often the slowest to adopt them. So it was with great interest that I listened to Guillermo Novo’s keynote at a recent SEMI Arizona Breakfast Forum, which kicked off a morning of presentations focused on smart manufacturing,... »
Site Design By
Recent Comments