Archives October 2017 - 3D InCites

aveni® S.A. Raises EUR 8.9M ($10.5M) to Commercialize its Innovative Metallization Technologies

aveni® S.A. Raises EUR 8.9M ($10.5M) to Commercialize its Innovative Metallization Technologies

PARIS, FRANCE–(Marketwired – Oct 24, 2017) – aveni S.A., developer and manufacturer of market disrupting wet deposition technologies and chemistries for 2D interconnects and 3D TSV packaging, today announced it has completed an EUR 8.9M ($10.5M) capital raise from Merck Ventures, the corporate venture arm of Merck, along with existing investors. “This new investment by corp... »

Electromagnetic Modeling of Three-dimensional Integrated Circuits

Electromagnetic Modeling of Three-dimensional Integrated Circuits

Three-dimensional Integrated circuits (3DIC) are generating increased interest as a way to increase speed and density while reducing power and form factor. System level integration in Package (SiP) has joined “System on Chip (SoC)” as one of the primary mechanisms to drive the electronics industry. Quotes such as “Smartphones and Tablets will increasingly owe their prowess to better chip pac... »

Panel Level Packaging: The Next Sleeping Giant? And Other Thoughts From IWLPC 2017

Panel Level Packaging: The Next Sleeping Giant? And Other Thoughts From IWLPC 2017

To the best of my recollection (and a quick search through 3D InCites’ archives) the panel level packaging (PLP) hoopla first hit the conference circuit in 2015 at the International Wafer Level Packaging Conference (IWLPC), when Jan Vardaman made it the topic of a panel discussion, and told a cautionary tale of following PLP down the rabbit hole. It seems that ever since, PLP has been an event h... »

UnitySC Opens Global Software Development Center and Customer Demo Lab in the U.S.

UnitySC Opens Global Software Development Center and Customer Demo Lab in the U.S.

Austin, Texas – Oct. 23, 2017 – UnitySC today announced at the International Wafer Level Packaging Conference (IWLPC) in San Jose, Calif., the opening of Unity Semiconductor Inc., the company’s new global software development center and North America customer demonstration lab located in Austin, Texas. The new facility serves as the company’s main center for software development and will h... »

Sir Walter Raleigh towered above the 50th IMAPS Symposium

Sir Walter Raleigh towered above the 50th IMAPS Symposium

Almost 500 years ago Walter Raleigh was born in England, rose rapidly in the favor of Queen Elizabeth I and was knighted in 1585. In 1587 he initiated the founding of Raleigh. Last week he welcomed – appropriately dressed – about one thousand semiconductor experts to the 50th International Symposium on Microelectronics at the Raleigh, NC, Convention Center (Figure 1). If you look closer at thi... »

imec and Analog Devices Sign Strategic Research Partnership for Development of Next-Generation IoT Devices

imec and Analog Devices Sign Strategic Research Partnership for Development of Next-Generation IoT Devices

LEUVEN, Belgium, and NORWOOD, MA —October 12, 2017—Imec, the world-leading research and innovation hub in nanoelectronics and digital technologies and Analog Devices, Inc. (ADI), the leading global high-performance analog technology company, today announced they have entered into a strategic research partnership to develop the next generation of Internet of Things (IoT) devices. With two initi... »

EV Group and SwissLitho to Develop Joint Nanoimprint Lithography Solution for 3D Optical Structures with Single-Nanometer Accuracy

EV Group and SwissLitho to Develop Joint Nanoimprint Lithography Solution for 3D Optical Structures with Single-Nanometer Accuracy

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and SwissLitho AG, a manufacturer of novel nanolithography tools, today announced a joint solution to enable the production of 3D structures down to the single-nanometer scale. Initially demonstrated within the “Single Nanometer Manufacturing for Beyond CMOS Devic... »

European Imaging and Sensors Summit: It’s Not Just About Pretty Pictures Anymore

European Imaging and Sensors Summit: It’s Not Just About Pretty Pictures Anymore

There’s no doubt about it. Imaging sensor technologies have come a long way since the introduction of the digital camera. In fact, according to Gartner, image-based sensors will be the single largest category of devices for the internet of things (IoT) sensing (figure 1). That fact was made imminently clear a few weeks ago at the European Imaging and Sensors Summit, which took place September 21... »

EDPS 2017: NOT the usual Electronic DESIGN Process Symposium

EDPS 2017: NOT the usual Electronic DESIGN Process Symposium

When planning the 24th EDPS, the organizing committee, chaired by Shishpal Rawat, former Intel executive, took a number of bold steps EDPS was traditionally held in the spring. We moved EDPS to the fall because that’s a time when more new IC projects are being planned. After many years of holding it in Monterey, we moved EDPS to Milpitas to make it more easily accessible for Silicon Valley folks... »

Spotlight on the European MEMS and Sensors Technology Showcase

Spotlight on the European MEMS and Sensors Technology Showcase

As it’s difficult to be in two places at one time, I was happy to see that the organizers of the co-located European MEMS and Sensors Summit/Imaging and Sensors Summits made sure two featured tracks —the MEMS and Sensors Technology Showcase and The Imaging Sensors Start-up Pitches — did not run in parallel. As a result, I attended both. This post focuses on the MEMS and Sensors Technolog... »