Archives September 2017 - 3D InCites

Making Sense of MEMS and Sensors at the MEMS/Imaging Sensors Summits

Making Sense of MEMS and Sensors at the MEMS/Imaging Sensors Summits

Last week, I had a whirlwind trip to Grenoble, France: 3 days, 2 summits, and 1 supercool paragliding festival, Coupe Icare, on the side – all filled with “Aha!” moments. Ironically, the paragliding event I attended on Saturday drove home the point of the most stand-out talk from the week: Peter Hartwell’s (TDK-Invensas) impassioned presentation titled “Archiving and Sharing Your Experie... »

CEA-Leti Orders KOBUS Solution To Pursue Long-Term Partnership for Advanced CVD

CEA-Leti Orders KOBUS Solution To Pursue Long-Term Partnership for Advanced CVD

Montbonnot, France, 20th of September 2017  ̶  KOBUS, a leading equipment supplier in advanced deposition solutions, and Leti, a technology research institute of CEA Tech, are pursuing their long-term partnership through the acquisition by Leti of the latest generation of F.A.S.T.® (Fast Atomic Sequential Technology) 200mm solution from KOBUS. It will be used to increase Leti’s process capab... »

Implementing Fan-Out Wafer-Level Packaging (FOWLP) with an HDAP Flow

Implementing Fan-Out Wafer-Level Packaging (FOWLP) with an HDAP Flow

Fan-out wafer-level packaging (FOWLP) is an emerging type of high-density advanced packaging (HDAP) technology in the semiconductor industry that is rapidly gaining popularity in the market. But what exactly is FOWLP? Why do we need it? How do we take advantage of it? What limitations still need to be overcome? FOWLP brings single and multi-die designs together, combining multiple die from heterog... »

Image Courtesy of TSMC Ltd.

TSMC’s OIP 2017 Symposium Shows The Awesome Power of an Ecosystem

Last week, September 13 to be exact, TSMC held its Open Innovation Forum (OIP 2017) Symposium at the Santa Clara Convention Center. Before getting into product and market details, allow me to share some of my general impression of this, as usual, very well-organized event. After several decades of experience with alliance management and ecosystem building, I see TSMC as the master of these discipl... »

 Integrated Solid-state Capacitors Based on Carbon Nanostructure 

 Integrated Solid-state Capacitors Based on Carbon Nanostructure 

The constant demand for miniaturization, added functionality and increased performance of electronic devices systematically drives higher integration by adding more devices on a single chip. In addition, 3-D or 2.5-D packaging, require on-chip or in-package capacitors, not only in traditional integrated circuits but also for integrated components, possibly on interposers, such as decoupling capaci... »

Samsung’s 8GB HBM2 Becomes a Standard for Innovative Graphic Cards

Samsung’s 8GB HBM2 Becomes a Standard for Innovative Graphic Cards

In the AMD-NVIDIA battle, System Plus Consulting’s experts continue to pursue innovation and monitor progress. At the beginning of the year, AMD was pleased to announce its forthcoming graphics processor unit (GPU) architecture, Vega. Presented at CES 2017 and commercially available mid-2017, AMD’s GPU has been meticulously analyzed by System Plus Consulting’s lab. And the answers are very i... »

Temporary Bonding and Debonding Technologies for Fan-out Wafer-Level Packaging

Temporary Bonding and Debonding Technologies for Fan-out Wafer-Level Packaging

Fan-out wafer-level packaging (FOWLP) is a cost-effective way to achieve high interconnect density and to manage larger I/O counts within an affordable package. It enables smaller footprints, higher interconnect density, better routing and thinner packages than current technologies. [1] A standard FOWLP wafer comprises known good die (KGD) and a redistribution layer (RDL) or layers embedded in mol... »

EV Group Receives Multiple Lithography and Metrology System Orders for Wafer-Level Optics Manufacturing

EV Group Receives Multiple Lithography and Metrology System Orders for Wafer-Level Optics Manufacturing

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received multiple orders for its comprehensive portfolio of manufacturing equipment and services designed to address the burgeoning demand for wafer-level optics (WLO) and 3D sensing. The market-leading portfolio comprises the EVG®770 automat... »

Fan-out Packaging Confirms its Success Story

Fan-out Packaging Confirms its Success Story

Fan-Out packaging solutions have been the hottest topic in the advanced packaging industry for two years, and that will remain true, announces Yole Développement (Yole). Will the fan-out market growth keep going? Who can challenge the leading semiconductor company, TSMC? Is panel technology coming? What will be the next killer application? Many important questions face the fan-out packaging indu... »

Rudolph Announces Multiple Customers’ Acceptance  of its Firefly Inspection System

Rudolph Announces Multiple Customers’ Acceptance of its Firefly Inspection System

Wilmington, Mass. (September 12, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that its Firefly™ Inspection Systems, shipped to fulfill previously announced orders from multiple semiconductor manufacturers, are now qualified for production. The Firefly Inspection Systems provide high-resolution visual and non-visual inspection in a variety of advanced packaging processes, inclu... »

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