Archives August 2017 - 3D InCites

Technology Showcase Finalists Revealed for European MEMS & Sensors Summit

Technology Showcase Finalists Revealed for European MEMS & Sensors Summit

GRENOBLE, France ─ August 28, 2017 – SEMI®, with its Strategic Association partner MEMS & Sensors Industry Group® (MSIG), today announced its shortlist of competitors for the Technology Showcase, which will take place on September 21 at the SEMI European MEMS & Sensors Summit 2017 in Grenoble. Selected by a committee of industry experts, five finalist companies will demonstrate advan... »

MRSI Systems Demonstrates MRSI-HVM3 and Sponsors the 1st Laser Executive Forum at CIOE

MRSI Systems Demonstrates MRSI-HVM3 and Sponsors the 1st Laser Executive Forum at CIOE

North Billerica, MA, August 25, 2017 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems will be exhibiting at the 19th China International Optoelectronics Exposition (CIOE) at the Shenzhen Convention and Exhibition Center with our Chinese Representative CYCAD Century Science and Technology (Booth #1C66) in Shenzhen, Se... »

Plasma-Therm and Trymax Partner to Distribute Resist Ashing Products in North America

Plasma-Therm and Trymax Partner to Distribute Resist Ashing Products in North America

ST. PETERSBURG, Florida and NIJMEGEN, The Netherlands (Aug. 15, 2017) – Plasma-Therm LLC, and Trymax Semiconductor Equipment BV, announced today that they have entered into a distribution agreement for North America. The agreement gives Plasma-Therm the exclusive rights to distribute all of Trymax’s NEO products for ashing applications. Plasma-Therm and Trymax can now address all ashing, p... »

New Solution for Testing Chips Prior to 3D Stacking

New Solution for Testing Chips Prior to 3D Stacking

Stacking chips on top of each other (aka 3D stacking) is a well-known approach to make more compact and powerful systems. Until now, it was impossible to probe the large arrays of fine-pitch micro-bumps on advanced chips before stacking. This had a negative effect on the compound yield (because of including faulty dies in the stack). Imec, together with FormFactor (formerly Cascade Microtech), has... »

Will Fully Autonomous Vehicles Solve Global Transportation Problems?

Will Fully Autonomous Vehicles Solve Global Transportation Problems?

Automotive electronics, with the Holy Grail being fully autonomous vehicles, is currently being touted as one of the biggest growth drivers for the semiconductor industry. So much so, that every event I’ve attended so far this year has featured sessions, presentations, keynotes, and panel discussions espousing the benefits of autonomous vehicles, the technologies that have been developed to enab... »

MRSI Systems Launches High-Speed Die Bonder for Photonics High-Volume Manufacturing

MRSI Systems Launches High-Speed Die Bonder for Photonics High-Volume Manufacturing

BILLERICA, Mass., August 14, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, is launching a new High-Speed Die Bonder, MRSI-HVM3, to support our photonics customers’ high volume manufacturing requirements. The MRSI-HVM3 is in full production and we are shipping to customers worldwide. Scaling Imperatives Our... »

3D Systems-on-Chip: Clever Circuit Partitioning To Extend Moore’s Law

3D Systems-on-Chip: Clever Circuit Partitioning To Extend Moore’s Law

In recent years, the technology of 3D integration has evolved into an economically interesting road. In particular, the technology is used to package the CMOS imagers you find in your smartphone, the high-bandwidth DRAM memory stacks used in high-end computing, as well as in advanced graphics cards. 3D integration allows a significant reduction of a system’s footprint and enables ever shorter an... »

Solving the Design and Verification Challenges of High Density Advanced Packaging

Solving the Design and Verification Challenges of High Density Advanced Packaging

Today’s electronic products present new challenges to product development teams. As a result, there is a constant push to improve product quality and design efficiency through the use of new design technologies. For example, system-scaling demands change as Moore’s law becomes increasingly difficult to maintain, thus driving growth of innovative PCB and packaging technologies such as: High-den... »

IMAPS 2017 SiP Conference Takes on Sonoma

IMAPS 2017 SiP Conference Takes on Sonoma

California’s Wine Country attracts visitors from all over the world. They can enjoy the scenic countryside, historic places, golf courses, tennis courts, gambling and of course great wine and excellent food. How well can a highly technical conference compete with all these “distractions”? Please read about the sessions I attended and judge for yourself! The Inaugural Conference and Exhibitio... »

MCM, SiP, SoC, and Heterogeneous Integration Defined and Explained

MCM, SiP, SoC, and Heterogeneous Integration Defined and Explained

Multichip module (MCM),  system-in-package (SiP), system-on-chip (SoC), and heterogeneous integration are all important semiconductor packaging technologies. They deserve to have, at the very least, a book written about them. However, herein I would like to give these technologies very simple descriptions. if you don’t mind. MCM MCM integrates different chips and discrete components side-by-si... »

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