Archives May 2017 - 3D InCites

Rudolph JetStep S Lithography System Advances Panel-based Advanced Packaging

Rudolph JetStep S Lithography System Advances Panel-based Advanced Packaging

Wilmington, Mass. (May 23, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received an order for its JetStep S Lithography System for fan-out panel-based advanced packaging processes. The system, which will ship in June 2017 to an outsourced assembly and test (OSAT) facility based in Asia, will be used to produce system-in-package (SiP) products that combine sensor, pro... »

Will IoT be the Next Killer App for Semiconductors?

Will IoT be the Next Killer App for Semiconductors?

At the end of April, I attended the Internet of Things (IoT) Developers Conference at the Santa Clara Convention Center. Because our semiconductor industry is expecting that IoT applications will significantly contribute to revenue growth, I wanted to get the latest about: If, how, when, why and for which applications IoT designs will be introduced and ramped into high-volume production. General i... »

The Dual-Gate Thin Film Transistor for 3D Dynamic and Flash Memory

The Dual-Gate Thin Film Transistor for 3D Dynamic and Flash Memory

Data is now the world’s most valuable resource. Solid-state storage of data is driving an innovation revolution built upon 50 years of progress. Here we look at the dual-gate thin film transistor (DG-TFT), an extremely versatile solid-state data storage device that can be used in monolithic 3D as either a flash memory or a dynamic memory element. It has the potential to provide a path not only ... »

SMIC Signs License Agreement For Invensas’ DBI Technology

SMIC Signs License Agreement For Invensas’ DBI Technology

Semiconductor Manufacturing International Corporation, one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, has executed a technology transfer and license agreement for Invensas’ Direct Bond Interconnect (DBI®) technology. Through this agreement, SMIC will be able to offer this bonding technology for use by image sensor manufa... »

EV Group Achieves Industry Milestone With Over 1100 Wafer Bonding Chambers Installed Worldwide

EV Group Achieves Industry Milestone With Over 1100 Wafer Bonding Chambers Installed Worldwide

Demand for EVG wafer bonding solutions driven by accelerated production ramp in advanced packaging, advanced MEMS devices, and CMOS image sensors FLORIAN, Austria, May 16, 2017—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved an industry milestone with more than 1100 EVG wafe... »

Are Glass Substrates the Next Option for Fan-out Packaging?

Are Glass Substrates the Next Option for Fan-out Packaging?

As you all may know, in most fan-out wafer level packages (FOWLP) such as embedded wafer level ball grid array (eWLB) by Infineon and STATS ChipPAC, and TSMC’s integrated fan out (InFO), the chip(s) are embedded in epoxy molding compound (EMC). Additionally, in some fan-out panel-level packaging (FOPLP) such as those being built by Fraunhofer IZM and J-Devices, the chip(s) are embedded in ... »

The 2017 3D InCites Awards Will Help Fund Kid Size Cures for Childhood Cancer

The 2017 3D InCites Awards Will Help Fund Kid Size Cures for Childhood Cancer

It’s that time of year again! With SEMICON West just over 2 short months away, we’re ready to launch the 2017 3D InCites Awards. The 2017 3D InCites Awards will be presented on Wednesday, July 12, 2017, during SEMICON West, in a ceremony at the Impress Lounge, (located above Moscone North). The ceremony will be followed immediately by a cocktail reception to benefit this year’s designate... »

UnitySC Receives Multiple Orders for Wafer Thinning Inspection Systems

UnitySC Receives Multiple Orders for Wafer Thinning Inspection Systems

Grenoble, France, May 9, 2017 – UnitySC, a leader in advanced inspection and metrology solutions, today announced multiple orders from a leading integrated device manufacturer (IDM) for its modular 4See Series automated defect inspection platform. The systems were selected because they deliver optimal wafer backside surface and edge defect inspection, post wafer thinning and metallization. The 4... »

Multiple Orders for Rudolph’s Firefly Inspection System Marks Early Success

Multiple Orders for Rudolph’s Firefly Inspection System Marks Early Success

 Wilmington, Mass. (May 1, 2017) Rudolph Technologies, Inc. (NYSE: RTEC) announced today that two of the industry’s leading suppliers of advanced packaging services have purchased multiple Firefly™ Inspection Systems. The Firefly System, with Rudolph’s patented Clearfind™ Technology, can detect defects that are almost impossible to find using conventional imaging techniques helping to sig... »

Meet Us at ECTC 2017 in Walt Disney World

Meet Us at ECTC 2017 in Walt Disney World

As each year passes, advanced packaging technologies offer more versatile solutions for cost-effective low-end applications, while 3D integration advancements continue to improve the performance of leading-edge products. This will be reflected at the 67th Annual Electronic Components and Technology Conference (ECTC), which takes place May 30, June 2, 2017, at the Walt Disney World Swan & Dolph... »