Archives March 2017 - 3D InCites

MEMS  Ascendant at IMAPS Device Packaging 2017

MEMS Ascendant at IMAPS Device Packaging 2017

Semiconductor device fabrication and packaging is rife with acronyms, and by my estimate, the Top 3 trafficked by speakers at the recent IMAPS Device Packaging Conference were the acronyms FOWLP, FOPLP, and MEMS. That would be fan-out wafer level packaging, fan-out panel level packaging, and microelectromechanical systems, respectively. It wasn’t that IMAPS was a MEMS packaging conference in the... »

Cost Comparison of Fan-out Wafer Level Packaging and Flip Chip Packaging

Cost Comparison of Fan-out Wafer Level Packaging and Flip Chip Packaging

In recent years, there has been an increased focus on fan-out wafer level packaging. While fan-out wafer level packaging may be the right solution for some designs, it is not always the lowest cost solution. Flip chip packaging, a more mature technology, continues to be an alternative to fan-out wafer level packaging. Both technologies are suitable for many of the same applications, and it is impo... »

Highlights of the 23rd TSMC Symposium

Highlights of the 23rd TSMC Symposium

On March 15, 2017, TSMC held its 23rd Symposium, based on popular request, at the Santa Clara Convention Center. I had the opportunity to attend the entire symposium and want to share some of my impressions and facts learned with you. TSMC, by far the biggest pure-play foundry, has pioneered the transition from integrated device manufacturers (IDMs) to the fabless and foundry business model and ha... »

MRSI Systems Delivered 3-Micron Die Bonder to AIM Photonics Academy’s Education and Practice Factory at MIT

MRSI Systems Delivered 3-Micron Die Bonder to AIM Photonics Academy’s Education and Practice Factory at MIT

North Billerica, MA, USA, March 20, 2017 — MRSI Systems, a leading provider of fully automated, high-speed, high-precision die bonding and epoxy dispensing systems, today announces the installation of its flagship MRSI-M3 Die Bonder in AIM Photonics Academy’s Education and Practice Factory at the Massachusetts Institute of Technology (MIT) in Cambridge, MA, USA. This is the beginning of a grea... »

drone technology

Executive Viewpoint: Next-Gen Drone Technologies Rely on Semiconductor Innovation

Robotics and drone technologies are one of the fastest growing end-use markets for integrated sensor technology today. According to a 2016 Yole Développement market report, the 2015 $351M US sensor market for drones and robots is expected to double by 2021, reaching US$ 709 million at a 12.4% CAGR. Key technologies include 3D cameras, solid state light detection and ranging (LIDAR), and ultra-pre... »

UnitySC Pushes The Boundaries of Measurement with New Nanotopography Metrology Platform

UnitySC Pushes The Boundaries of Measurement with New Nanotopography Metrology Platform

Grenoble, France, March 14, 2017 – UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today introduced its new NST Series at SEMICON China in Shanghai. The NST Series is the world’s first non-contact metrology solution for accurately measuring the nanoscale surface topography of semiconductor wafe... »

Dev Gupta Disrupts the Fan-out Panel at IMAPS DPC, You Won’t Believe What Else Happened!

Dev Gupta Disrupts the Fan-out Panel at IMAPS DPC, You Won’t Believe What Else Happened!

Here we go again! One thing is for sure, there is never a dull moment at the IMAPS Device Packaging Conference panel sessions. (Remember the year of Alphabet Soup?) Maybe it’s because they take place AFTER everyone’s had a few drinks, but this year was especially lively and entertaining. There was humor, there was drama, AND there was a really good story being told at the fan-out panel discus... »

EV Group Breaks Speed and Accuracy Barrier in Mask Alignment Lithography for Semiconductor Advanced Packaging

EV Group Breaks Speed and Accuracy Barrier in Mask Alignment Lithography for Semiconductor Advanced Packaging

FLORIAN, Austria, March 8, 2017—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the IQ Aligner NT—its latest and most advanced automated mask alignment system for high-volume advanced packaging applications. Featuring high-intensity and high-uniformity exposure optics, new wafer handling hardwa... »

The FAST route to the Top of the TSV Mountain

The FAST route to the Top of the TSV Mountain

. While on a recent visit to UnitySC in Grenoble, France, I spent some time visiting with a semiconductor process equipment company that shares the same cleanroom space: KOBUS. Named for a genus of the African antelope for its elegance and speed, the company has developed a unique approach to deposition for through silicon via (TSV) metallization processes (barrier, seed and fill) combining the pe... »

What’s in Store For You at IMAPS DPC 2017

What’s in Store For You at IMAPS DPC 2017

Just under a week away, the agenda for the 2017 IMAPS Device Packaging Conference and co-located Global Business Council is geared to inspire attendees about the growing importance of heterogeneous integration technologies supported by advanced wafer level packaging, 2.5D, and 3D integration. While the quest for smaller silicon nodes continues, it’s well understood that these technologies are fi... »