Archives January 2017 - 3D InCites

2017 European 3D Summit: Making Advanced Packaging Great Again

2017 European 3D Summit: Making Advanced Packaging Great Again

Every year, I attend most of the events that are focused on 3D integration and related approaches to semiconductor advanced packaging. One thing that I’ve heard over the past year is that as 3D technologies move into manufacturing, it’s become difficult to recruit speakers who have fresh content. Notoriously slow to evolve, the 3D integration conversation hasn’t changed too much over the pas... »

FOGALE Nanotech Group Subsidiary UnitySC Opens New Global Headquarters in Grenoble, France

FOGALE Nanotech Group Subsidiary UnitySC Opens New Global Headquarters in Grenoble, France

Grenoble, France – UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today announced the opening of its global headquarters in Grenoble, France, the heart of the French Silicon Valley. This location strategically positions the company in one of Europe’s key semiconductor research and manufacturi... »

TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP

TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fan-out WLP (FO-WLP). Driven by demand for thin, low-profile packages in smartphones, tablets, and wearable devices such as smart watches, fitness bands, and virtual reality headsets, fan-in WLPs are projected to have a >10% gr... »

Addressing Advanced Packaging Challenges in 2017 and Beyond

Addressing Advanced Packaging Challenges in 2017 and Beyond

As the two-dimensional (2D) shrinking of planar circuits (on which Gordon Moore based his famous observation) has become more difficult and expensive, the semiconductor industry has had to find other ways to continue to put more computing power and speed into less volume. At the same time, consumers are demanding greater functionality that integrates a variety of interconnected circuit types. The ... »

Outlook 2017: Advanced Packaging Technology Takes Center Stage

Outlook 2017: Advanced Packaging Technology Takes Center Stage

The era of “More than Moore” was alive and well in 2016 as the semiconductor industry witnessed many new developments in advanced packaging. Among these was the production of the first hybrid bonded image sensor, which enables high-performance image processing as well as on-sensor memory to provide faster extraction and processing of images. As this image sensor technology enables an entirely ... »

What the Heterogeneous Integration Technology Roadmap Will Mean for 2017

What the Heterogeneous Integration Technology Roadmap Will Mean for 2017

While it seems that the semiconductor industry has suddenly embraced heterogeneous integration as the next revolutionary innovation to further the quest for higher performance and lower-power, lower-cost devices, it has actually been developing over the past four or more years. We at Dow Electronic Materials, along with many others in the industry, have been and continue to be active participants ... »

Top Ten Reasons to Attend the 2017 European 3D Summit

Top Ten Reasons to Attend the 2017 European 3D Summit

It’s that time of year again! For the 5th consecutive year, SEMI Europe is hosting the European 3D Summit (formerly known as the 3D TSV Summit for editions 1-3), and it’s shaping up to be a stellar event. If you are still wavering about attending, here are 3D InCites’ top ten reasons to attend: 10: The opportunity to visit beautiful Grenoble, and taste the local fare with your industry colle... »

13th 3D ASIP Conference Demonstrates Manufacturer’s Commitment

13th 3D ASIP Conference Demonstrates Manufacturer’s Commitment

The 3D Architectures for Semiconductor Integration and Packaging (3D ASIP) conference is one of the biggest (if not THE biggest) event focused exclusively on the 3D IC family of technologies. The December 2016 event was held even closer to San Francisco airport than in previous years. From the lobby of the SFO Marriott Hotel, we could see planes taking off and landing.  Every smooth touch-down an... »

imec Collaborates with Antwerp and Flanders to Establish Smart City Living Lab

imec Collaborates with Antwerp and Flanders to Establish Smart City Living Lab

How can the Internet of Things change the future of the average citizen? To answer this question, imec joins forces with the City of Antwerp and the Flanders region to turn Antwerp into a Smart City Living Lab in which businesses, researchers, local residents and the city itself will experiment with smart technologies that aim to make urban life more pleasant, enjoyable and sustainable. “Making ... »

Outlook 2017:  SoC Goes on a Dielet

Outlook 2017: SoC Goes on a Dielet

It’s 2017, and system-on-a-chip (SoC) is headed for a dielet. At least that’s my 2017 outlook, based on takeaways from some of the recent conferences I’ve attended, including, to close out 2016, 3D ASIP last month in Burlingame, CA. SoC has been packing on weight in recent years, and it’s beginning to show, to SoC’s detriment. For example, the old ISO defect density rules from my early I... »