Archives November 2016 - Page 2 of 2 - 3D InCites

TechSearch International Analysis Shows CSP Growth Remains Strong

TechSearch International Analysis Shows CSP Growth Remains Strong

Despite a slowing growth rate for smartphones, the industry is experiencing strong growth for CSP packages such as QFNs and stacked die CSPs.  TechSearch International’s latest CSP market forecast shows an 8% CAGR from 2015 to 2020.  One of the categories with the strongest growth is the quad flat no-lead (QFN) package with a CAGR of 8.6%. QFNs are a low-cost, low-profile package found in a wi... »

SPTS's Sigma fxP PVD system

Orbotech’s SPTS Technologies Extends Leadership in FOWLP PVD Equipment

NEWPORT, UK, November 3, 2016 | SPTS Technologies, an Orbotech company and a supplier of advanced wafer-processing solutions for the global semiconductor and related industries, today announced that it has received an order from NANIUM, S.A., a Portugal-based semiconductor manufacturing, test and engineering services provider, for a 300mm Sigma fxP PVD system to expand NANIUM’S Fan-out Wafer Lev... »

What Will Happen With the Chinese Advanced Packaging Ecosystem?

What Will Happen With the Chinese Advanced Packaging Ecosystem?

In 2015, more than US$1 billion was invested in China’s advanced packaging ecosystem, announces Yole Développement (Yole) in its report Status and Prospects for the Advanced Packaging Industry. And right now, more than 100 companies are involved in assembly and packaging activities in China. Almost all key global integrated device manufacturers (IDMs) and outsourced assembly and test (OSATs)... »

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