Archives November 2016 - 3D InCites

What’s New for the 2017 European 3D Summit

What’s New for the 2017 European 3D Summit

For the fifth consecutive year, the European 3D Summit returns to Grenoble, January 23-25, 2017. The event has evolved over those years, beginning its tenure as the 3D TSV Summit, then last year re-branded as the 3D Summit in acknowledgment that not everything in 3D has to do with through silicon vias (TSVs). I’ve been honored to attend the four previous years, and have found the event to consis... »

3D TSV IP Landscape for Memory Applications: Who Owns What?

3D TSV IP Landscape for Memory Applications: Who Owns What?

The last two years have shown some important changes within the 3D through silicon via (TSV) memory market. First commercial products including 3D stacked (3DS), DDR4, high bandwidth memory (HBM) and hybrid memory cube (HMC) have been released by the microelectronics giants. Then first 3D TSV IP patent litigations took place between ELM 3DS and leaders such as Samsung Electronics, SK Hynix, and Mi... »

MEPTEC Roadmap 2016: Best Time in History to be in the Packaging Business

MEPTEC Roadmap 2016: Best Time in History to be in the Packaging Business

With nary a farewell glance in the rearview mirror at the terrain successfully covered over the decades during which we followed the ITRS’ Guide Michelin; the new Heterogeneous Integration Roadmap gives us eyes on what comes next. It looks from here-and-now all the way to a horizon that extends, like a straight highway crossing America’s vast Great Plains, a long way out. Fifteen years out. A ... »

MEMS & Sensors Executive Congress 2016 Sets Out to Conquer the Internet of Countless Things

MEMS & Sensors Executive Congress 2016 Sets Out to Conquer the Internet of Countless Things

A shift has occurred. As MEMS becomes mainstream, the focus of the annual MEMS & Sensors Executive Congress (MEC 2016) was less on MEMS development and more about the fun part: how we put these technologies to work for us. As Stefan Finkbeiner, Bosch Sensor Systems so eloquently put it, “Nobody wants to buy an accelerometer anymore, they want a step counter.” So how do we capture the value... »

Direct Bond Interconnect (DBI®) Technology as an Alternative to Thermocompression Bonding

Direct Bond Interconnect (DBI®) Technology as an Alternative to Thermocompression Bonding

The industry standard interconnect technology for fine-pitch 2.5D assembly and 3D stacking is thermocompression bonding of solder capped μbumps. This technology has several challenges which have limited widespread adoption in high-volume production. While the implementation of the technology at 40μm pitch is already challenging, the likelihood of extending this technology to 10μm pitch is slim,... »

At the Crossroads of CVD and ALD, KOBUS Makes its Mark on 3D TSVs

At the Crossroads of CVD and ALD, KOBUS Makes its Mark on 3D TSVs

Last July at SEMICON West, I was honored to witness the dramatic unveiling of UnitySC, the new company formed as a result of Fogale Group’s acquisition of Altatech, resulting in a semiconductor equipment portfolio that spans the spectrum of process control needs for advanced wafer-level and 3D packaging, including metrology, edge inspection, and defect detection. But that was only part of the st... »

SEMICON Europa 2017 Moves to Munich

SEMICON Europa 2017 Moves to Munich

So here’s a funny story.  At the MEMS Summit in Stuttgart in September, while chatting with Denny McGuirk President and CEO, SEMI, I suggested that SEMICON Europa 2017 would be better attended if it was held in Munich. I’ll admit this was mostly selfishly motivated, as I’ve made the trek from Phoenix to Dresden and Grenoble for industry events, and it’s not an easy one. (Full disc... »

IWLPC 2016 Keynotes Look to A Connected Future Enabled by Advanced Packaging

IWLPC 2016 Keynotes Look to A Connected Future Enabled by Advanced Packaging

The 2016 International Wafer-Level Packaging Conference (IWLPC), which took place October 18-20, 2016 in San Jose, CA, focused on a theme of “Bridging the Interconnect Gap”, as the industry faces new challenges due to the onslaught of Big Data brought about by the Internet of Things (IoT). To provide vision on how best to address these challenges using advanced packaging technologies, the IWLP... »

MEMS & Sensors Industry Group Reveals Tech Showcase Finalists

MEMS & Sensors Industry Group Reveals Tech Showcase Finalists

MEMS & Sensors Industry Group (MSIG)’s annual MEMS & Sensors Technology Showcase at MEMS & Sensors Executive Congress® 2016 (November 9-11, 2016 in Scottsdale, AZ) highlights some of the newest and most unique MEMS/sensors-enabled applications in the industry. MSIG today announced the shortlist of finalists who will compete for the title of “winner” at this year’s even... »

Package-on-Package Interconnects for Fan-out Wafer Level Packages

Package-on-Package Interconnects for Fan-out Wafer Level Packages

Consumer electronics designers continue to demand thinner and lighter packages while devices increase in functional complexity. The Fan-Out Wafer Level Package (FOWLP) platform has been gaining momentum with the advantages it offers in electrical performance, assembly process efficiency and low geometric profile.  Different approaches of Package-on-Package (PoP) stacking in FOWLP have been develo... »

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