Archives September 2016 - Page 2 of 2 - 3D InCites

plasma dicing

The Growth and Emergence of New Dicing Technologies

Driven by rising demand for thinner wafers and stronger die, dicing technologies are evolving. “Reaching more than US$100 million in 2015, the dicing equipment market will double by 2020-2021”, announces Yole Développement (Yole) (Source: Thin Wafer Processing & Dicing Equipment Market report, Yole Développement, May 2016). Yet at the same time, thin wafers are creating new challenges of... »

Executive Viewpoint: Lithography’s Rising Star in the Year of the Fan-Out Package

Executive Viewpoint: Lithography’s Rising Star in the Year of the Fan-Out Package

There is no doubt about it, 2016 is turning out to be the year of fan-out wafer level packaging (FOWLP) as the entire semiconductor industry turns to advanced wafer level packaging and system-in-package solutions to take the world to its next generation of connectivity, in which our smartphones drive our lives, and the Internet of Things becomes a reality. While lithography is often thought of as ... »

Rudolph Technologies Unveils New Inspection Suite for Front- and Back-end Semiconductor Manufacturing

Rudolph Technologies Unveils New Inspection Suite for Front- and Back-end Semiconductor Manufacturing

Rudolph continues to drive the technological innovation of its inspection and metrology products to deliver solutions that address the demanding needs across front- and back-end processes Wilmington, Mass. (September 6, 2016)—Rudolph Technologies, Inc. (NYSE: RTEC) today launched two new inspection and metrology solutions for advanced semiconductor manufacturing: the Firefly™ System for high-r... »

Deca Technologies Receives Major Investment for M-Series™ Fan-out Growth

Deca Technologies Receives Major Investment for M-Series™ Fan-out Growth

TEMPE, Arizona – September 1, 2016 – Deca Technologies, a wafer level electronic interconnect solutions provider to the semiconductor industry, announced today the receipt of an additional $51.5 million investment from a leading electronics company. Combined with the previously announced investment from ASE of $60 million, and following the repurchase of $20.6 million of shares held by Cypress... »

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