Archives September 2016 - 3D InCites

Gartner: New Normal is Slow Growth, Plentiful FOWLP

Gartner: New Normal is Slow Growth, Plentiful FOWLP

What is the “new normal” for semiconductors? Jim Walker, Research VP, Semiconductor Manufacturing, Gartner, closed out Q3 2016 with his informative talk at the IMAPS | MEPTEC | SEMI Northern California Chapter luncheon meeting on September 28, 2016, at SEMI HQ in San Jose, California, addressing the topic of the “New Normal” for Semiconductors. Remember diagraming P.E.S.T analyses ... »

Will The Lifespan of CMOS Integrated Circuits End?

There is fierce competition for scaling foundry logic technologies. However, according to the 2015 International Roadmap for Semiconductors (ITRS), logic transistor scaling will stop at 10nm and it will no longer be economically desirable for companies to continue traditional transistor miniaturization in microprocessors1. How will this impact the lifespan of CMOS integrated circuits? (Figure 1)... »

More Food for Thought From The 2016 European MEMS Summit

More Food for Thought From The 2016 European MEMS Summit

Granted, while there may not have been a single “aha!” moment at the 2016 European MEMS Summit, held September 15-16 in Stuttgart Germany, the speakers did provide interesting food for thought as they talked about their companies’ activities and offerings in MEMS and sensor technology. 2016 European MEMS Summit from 3D InCites on Vimeo. In addition to the summary I posted earlier this week,... »

GLOBALFOUNDRIES Exceeds Expectations at GTC 2016

GLOBALFOUNDRIES Exceeds Expectations at GTC 2016

If you need hard evidence that consolidation in the semiconductor industry can be a good thing, then look no further than the visible success GLOBALFOUNDRIES is enjoying in the year-and-change since it completed its acquisition of the IBM Microelectronics business. In the 01 July 2015 press release GF issued about the acquisition, Sanjay Jha, chief executive officer of GLOBALFOUNDRIES, was quoted ... »

European MEMS Summit 2016: Are MEMS Manufacturers Richer than Last Year?

European MEMS Summit 2016: Are MEMS Manufacturers Richer than Last Year?

After the European MEMS Summit 2016 concluded on Friday afternoon (September 15-16, 2016), one of the attendees asked me which presentation was  my favorite presentation. I mulled it over, first declaring it was the Intel presentation by Raji Baskaran, and then Jérémie Bouchaud’s (IHS) presentation. And then it hit me: in all honesty, my favorite presentation was the closing remarks, deli... »

System Plus Consulting confirms: Apple A10 processor uses TSMC’s inFO technology

System Plus Consulting confirms: Apple A10 processor uses TSMC’s inFO technology

System Plus Consulting announces the release in the next few weeks of a complete report on TSMC’s Integrated Fan-Out (inFO) technology used for Apple’s A10® processor packaging. And few results are already available. Indeed System Plus Consulting’s experts propose you to discover a previous of the first conclusions. Featured in the latest Apple iPhone 7®, the Apple A10 processor has high... »

Leti Orders HERCULES® NIL System from EV Group for Joint Nanoimprint Lithography Program

Leti Orders HERCULES® NIL System from EV Group for Joint Nanoimprint Lithography Program

Nanoimprint lithography (NIL) system will bolster process development and demo capabilities of INSPIRE program EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, and Leti, an institute of CEA Tech, announced today that Leti has ordered a HERCULES® NIL track system from EVG. The HERCULES NIL system will be install... »

MEMS and Sensors Industry Group Becomes Part of SEMI

MEMS and Sensors Industry Group Becomes Part of SEMI

Peter Clarke, EE Times, and I both agree – the biggest news of this year’s SEMI MEMS Summit, which took place September 17-18, 2016 in Stuttgart, Germany, was the announcement that SEMI is forming a strategic association partnership with the MEMS and Sensors Industry Group (MSIG). “This is good news, as the SEMI machine can take the MEMS discussion around the globe,” said Clarke. The pres... »

A Fan-Out Wafer Level Packaging Epiphany

A Fan-Out Wafer Level Packaging Epiphany

I’ve had an epiphany regarding fan-out wafer level packaging (FOWLP). Epiphany: “A usually sudden manifestation or perception of the essential nature or meaning of something.” In FvT’s piece “Spotlight on FOWLP, Monolithic 3D IC, and 3D TSVs,” (13 May 2015) I am quoted saying: “Show me where monolithic or FOWLP is … can’t seem to find it.” I wasn’t alone in my thinking; we re... »

Quantum Mechanical Advantage: A Revolution through Evolution for Storage Class Memory

Quantum Mechanical Advantage: A Revolution through Evolution for Storage Class Memory

I was again struck by the same epiphany as last year as I escaped the Californian sun to reach the air-conditioned Flash Memory Summit (FMS). The major part of the solid state storage industry depends on NAND Flash. All NAND Flash, whether it be 2-D or 3-D, floating gate or charge trap, depends on a quantum mechanical effect called tunneling or barrier penetration. This effect, discovered in the l... »

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