Archives July 2016 - 3D InCites

The 2016 3D InCites Awards Scholarship goes to Sophie Mathis!

The 2016 3D InCites Awards Scholarship goes to Sophie Mathis!

Ever since we first established 3D InCites Awards program in 2013, our intention was to use the funds generated by sponsorship to promote STEM-based education. This year, thanks to the generosity of our platinum sponsor, KLA-Tencor, as well as silver sponsors, Yole Développement, and Amkor Technology, Inc., we are awarding the $2500 3D InCites Awards Scholarship to Sophie Mathis, a 14-year-old 10... »

SEMICON West 2016: Update from the Semiconductor Suppliers

SEMICON West 2016: Update from the Semiconductor Suppliers

Every year at SEMICON West, in addition to taking in keynotes and technology sessions, I like to catch up with semiconductor suppliers to find out about any significant news, their latest offerings and how they are enabling next-generation manufacturing. Here are this year’s highlights. UnitySC One of the big stories of the week was the launch of UnitySC, a subsidiary of Fogale Nanotech, the re... »

The New Heterogeneous Integration Roadmap: Seeing Beyond the Lamp Post

The New Heterogeneous Integration Roadmap: Seeing Beyond the Lamp Post

If you, like me, have been wondering about when and where it was you last saw an International Technology Roadmap for Semiconductors update, wonder no more. You didn’t miss the update; rather, it just never really came. (See FvT’s piece on Bill Bottoms and “Revamping the ITRS Roadmap” from March 12, 2015 for more.) From the ITRS itself we are told how “In 2012 it became evident that the ... »

Making Connections at SEMICON West 2016

Making Connections at SEMICON West 2016

If you attended SEMICON West 2016 last week, you probably noticed that the event is undergoing a metamorphosis. It was hard to miss. The signs were everywhere. Literally: It’s not surprising, since everything about the semiconductor manufacturing industry has been evolving over the past few years, and everyone, including SEMI, is feeling the impact. As Karen Savala, President, SEMI Americas, exp... »

Rudolph Technologies Announces New Clearfind Technology for Advanced Packaging Inspection

Rudolph Technologies Announces New Clearfind Technology for Advanced Packaging Inspection

Wilmington, Mass. (July 11, 2016)—Rudolph Technologies, Inc. (NYSE: RTEC) today unveiled its new patented Clearfind™ technology, which can detect organic defects that are difficult or impossible to see with conventional white-light imaging techniques. Organic contaminants are often the root cause of field failures, which occur after the material has been exposed to operating conditions for ex... »

Heterogeneous Integration enabled by Advanced Packaging Leads the Way at SEMICON West 2016

Heterogeneous Integration enabled by Advanced Packaging Leads the Way at SEMICON West 2016

I have to admit, after attending this week’s SEMICON West 2016, I’m feeling a little smug. Why? Because after years of waiting in the shadows for its day in the sun, advanced packaging is finally getting its turn, thanks to the push towards heterogeneous integration, which relies on advanced packaging technologies to integrate a multitude of disparate technologies including MEMS and sensors, l... »

EV Group Rolls Out Automated Metrology System for Advanced Packaging, MEMS and Photonics Manufacturing

EV Group Rolls Out Automated Metrology System for Advanced Packaging, MEMS and Photonics Manufacturing

FLORIAN, Austria, July 11, 2016—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®50 automated metrology system. Designed to support the increasingly stringent manufacturing requirements for advanced packaging, MEMS and photonics applications, the EVG50 performs high-resolution non-destr... »

And the Winners of the 2016 3D InCites Awards are…..

And the Winners of the 2016 3D InCites Awards are…..

 For the fourth consecutive year, the Impress Lounge played host to the 3D InCites Awards Ceremony, during which individuals, companies, and products were recognized by their peers for excellence in 3D packaging technologies. This year, we mixed it up a bit, and rather than recognize the processes, materials, designs and tools developed to enable advanced wafer level packaging (WLP), we focused o... »

Convergence on the “Big Five”: Focus on Wafer-based Advanced SiP

Convergence on the “Big Five”: Focus on Wafer-based Advanced SiP

In the fourth installment of the series “Convergence on the Big Five,” we compared conventional SiP with advanced system-in-package (SiP), which is focused on laminate-based approaches, and is available and in production today. Advanced SiP packaging has been a game changer in addressing system-level integration and providing the lowest form factor at cost and performance points that address m... »

Cast your votes for the 2016 3D InCites Awards

Cast your votes for the 2016 3D InCites Awards

This year’s awards will be decided entirely by your industry peers through this online voting process. The nominees are listed below by category. You must be registered and logged in to vote. Please vote for one per category. You may vote one time in a 24 hour period. Standings will be displayed until July 5, but to keep it interesting, we will hide the standings for the last three days of votin... »

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