Archives June 2016 - 3D InCites

Convergence on the “Big Five”: Focus on Laminate-based Advanced SiP

Part four in a five-part series While many industry experts have long predicted the demise of Moore’s law, it’s only in the past few months that it seems we have exhausted current CMOS scaling methods. While it’s likely that scaling approaches will resume in the future as new materials, processes, and tools are developed, the reality is that these solutions are still in the early stages of d... »

Executive Viewpoint: The New Advanced Packaging Landscape

Executive Viewpoint: The New Advanced Packaging Landscape

You might recall that a few year’s back (October 2013, to be precise), 3D InCites’ regular blogger, Paul Werbaneth, had the opportunity to interview Dongkai Shangguan, then CEO of the National Center for Advanced Packaging (NCAP) in Wuxi, China, which he helped found along with nine investors. They talked about lots of timely topics: the importance of industry-wide collaboration to bring down ... »

MEMS & Sensors Industry Group Invites Collaboration in MEMS, Sensors and ICs at SEMICON West 2016

MEMS & Sensors Industry Group Invites Collaboration in MEMS, Sensors and ICs at SEMICON West 2016

PITTSBURGH (June 29, 2016) – MEMS & Sensors Industry Group® (MSIG) invites attendees to a special half-day workshop on the convergence of MicroElectroMechanical Systems (MEMS) devices, sensors, flexible substrates and semiconductors in the Internet of Things (IoT) at SEMICON West on July 13, 2016. Speakers will explore the theme “From Collision to Convergence: Co-Creating Solutions in the... »

Rudolph Receives Multi-System Order From a Leading OSAT for Fan-out Wafer Level Packaging Inspection

Rudolph Receives Multi-System Order From a Leading OSAT for Fan-out Wafer Level Packaging Inspection

Wilmington, Mass. (June 28, 2016)—Rudolph Technologies, Inc. (NYSE: RTEC), a leader in the design, development, manufacture and support of defect inspection, lithography, metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide, announced today that a leading OSAT in Asia has placed an order for over $11 million USD for an integrated so... »

Amkor Opens MEMS Packaging Line in China

Amkor Opens MEMS Packaging Line in China

TEMPE, Ariz., June 28, 2016 – Driven by the increase in global demand for sensors from the smartphone and automotive markets, Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced it is ramping up a new MEMS and sensor packaging line at its facility in Shanghai. This new, state-of-the-art line will build on the expertise developed... »

Ag Tech, Analog Devices, and the Quantified Tomato

Ag Tech, Analog Devices, and the Quantified Tomato

The Quantified Self movement has made headlines and grabbed press attention in recent years, ever since people started bedecking themselves with what we now call wearables, but the idea of measuring human performance and the human condition started long before wearable sensors themselves. It may have started as long ago as Plato: “The measure of a man is what he does with power.” Still true, t... »

Reinventing Paper for Electronics and 3D Technology

Reinventing Paper for Electronics and 3D Technology

Organic paper, particularly cellulose-based paper, efficiently served in previous eras as an engineering material. In the Tang dynasty, soldier armors were mainly made of paper [57]. In the era of analog computing, paper volvelles [18] were used, in particular, in the calculation of physical phenomena. The E6-B flight computer is a paper volvelle that was used by pilots to determine, for instance,... »

EV Group Scores Fourth Consecutive Triple Crown Win in Annual VLSIresearch Customer Satisfaction Survey

EV Group Scores Fourth Consecutive Triple Crown Win in Annual VLSIresearch Customer Satisfaction Survey

FLORIAN, Austria, June 21, 2016—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that, for the fourth successive year, it has earned all three awards resulting from VLSIresearch Inc.’s annual Customer Satisfaction Survey. For 2016, EVG was ranked as one of the 10 BEST Focused Chip Making Equipm... »

3D/TSV Officially Recognized as Advanced Manufacturing Technology at SEMI ASMC 2016

3D/TSV Officially Recognized as Advanced Manufacturing Technology at SEMI ASMC 2016

As Dick James, Chipworks, puts it, the SEMI Advanced Manufacturing Conference is “… an annual conference focused on the manufacturing of semiconductor devices; in this it differs from other conferences, since the emphasis is on what goes on in the wafer fab, not the R&D labs, and the papers are not research papers – some are better described as ‘tales from the fab’! After all, it’s... »

What is Driving the Advanced Packaging Market in China?

What is Driving the Advanced Packaging Market in China?

Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced packaging revenue in China is expected to reach US$ 4.6 billion in 2020, against US$ 2.2 billion in 2015, announces Yole Développement (Yole). This market is showing an impressive 16% CAGR[1] during this period. China has the world’s largest po... »

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