Wilmington, Mass.—Rudolph Technologies, Inc. (NYSE: RTEC) is pleased to announce the availability of new, high-speed 3D metrology on its flagship NSX® Series, a highly-flexible inspection and measurement platform for process development and control of die-level interconnects. Already in use by multiple customers worldwide, the NSX Series with high-speed 3D metrology is capable of both high-volume production monitoring and advanced process development.

“The new capability provides a 200-400 percent throughput improvement over our previous Wafer Scanner bump metrology system, and when paired with our Discover® Software, provides a complete coplanarity solution for our customers,” said Scott Balak, Rudolph’s director, inspection product management. “With the increasing number of new packaging technologies being developed by foundries, outsourced assembly and test (OSAT) manufacturers, and integrated device manufacturers (IDMs), the flexibility and reliability of this new capability on the trusted NSX Series platform is especially valuable to customers seeking to move rapidly from pilot lines to production.”

Data is collected in seconds from millions of bumps and then analyzed by Rudolph’s Discover Software analysis database. Engineers gain unique insight into critical metrology applications, from both an individual bump point of view or holistically as a wafer, as part of a simultaneous product and process control solution.

“Manufacturers are looking for a more comprehensive and flexible process control solution that provides, not only inspection or bump data, but also usable analytical information about their processes,” said Mike Goodrich, vice president and general manager of Rudolph’s Process Control Group. “Our powerful Discover analysis software provides insight into the process that is otherwise unavailable to process control tool owners. The high-speed 3D bump metrology capability incorporates a three segment optical range, giving our customers the flexibility to control both smaller micro bumps and larger traditional solder bumps with a single inspection and metrology platform. When combined with Rudolph’s advanced automation capability, customers can measure thin and warped wafers without the extra expense of frame and tape mounting.”

Goodrich concluded, “We understand the importance of 3DIC and next-generation packaging processes and we have aggressively pursued development of this comprehensive 3D coplanarity solution to meet our customers’ needs for a cost efficient, multi-functional process control tool.”

For more information about the NSX Series, please visit www.rudolphtech.com.

About Rudolph Technologies

Rudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, lithography, process control metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide. Rudolph delivers comprehensive solutions throughout the fab with its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market of their devices. Headquartered in Wilmington, Massachusetts, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at www.rudolphtech.com.

Safe Harbor Statement

This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the “Act”) which include the benefits to customers of Rudolph’s products, Rudolph’s business momentum and future growth, Rudolph’s existing market position and its ability to maintain and advance such position relative to its competitors and Rudolph’s ability to meet the expectations and needs of our customers as well as other matters that are not purely historical data. Rudolph wishes to take advantage of the “safe harbor” provided for by the Act and cautions that actual results may differ materially from those projected as a result of various factors, including risks and uncertainties, many of which are beyond Rudolph’s control. Such factors include, but are not limited to, delays in shipping products for technical performance, component supply or other reasons, the company’s ability to leverage its resources to improve its positions in its core markets and fluctuations in customer capital spending. Additional information and considerations regarding the risks faced by Rudolph are available in Rudolph’s Form 10-K report for the year ended December 31, 2015 and other filings with the Securities and Exchange Commission.  As the forward-looking statements are based on Rudolph’s current expectations, the company cannot guarantee any related future results, levels of activity, performance or achievements. Rudolph does not assume any obligation to update the forward-looking information contained in this press release.


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