Archives April 2016 - Page 2 of 2 - 3D InCites

The Advanced Packaging Industry Reaches its Zenith

The Advanced Packaging Industry Reaches its Zenith

To overcome the current market and technology constraints taking place today within the semiconductor industry, new advanced packaging technologies have been developed by industrial companies. Leaders in the advanced packaging industry have identified new solutions enabling more and more functionalities to be integrated along with many devices in the same package. Yole Développement analysts are ... »

Opportunities for 2.5D and 3D Cost Reduction

Opportunities for 2.5D and 3D Cost Reduction

A little over a year ago, I wrote a Knowledge Portal entry about the cost of 3D ICs. Here I am again to tackle the issue of 2.5D and 3D cost reduction from a slightly different angle. This entry is based on what SavanSys presented at IMAPS Device Packaging 2016. The previous Knowledge Portal entry spent time discussing cost drivers; a few specific numbers were provided, but overall, the details we... »

High Tech, AgTech, Steinbeck:   A Distinctive Note of Silicon in the Salinas Valley Terroir

High Tech, AgTech, Steinbeck: A Distinctive Note of Silicon in the Salinas Valley Terroir

Keizai Silicon Valley, the organization here promoting network-building as a means of achieving successful US-Japan business relations, put on one of the most interesting programs this past week that I’ve attended year-to-date; a Keizai Silicon Valley panel discussion focused on “Trends in AgTech: Real Needs in the Industry.” Without looking, how far do you estimate it is from Silicon Val... »

Image source gratisography.com

3D IC Test: Now and The Road Ahead

Solutions for 3D IC test are ready today, but they will be more ready tomorrow. At the 2015 ISTFA, I presented a tutorial titled “What is New in 3D, Digital Testing?” and I’ll summarize the main points here. I consider test standards and test challenges, which include known-good-die and testing stacked die. The two main goals of 3D IC test are to improve the pre-packaged test quality and to ... »

Advanced Packaging and 3D come to MRS Spring Meeting

Advanced Packaging and 3D come to MRS Spring Meeting

For the first time ever, the Materials Research Society (MRS) brought its annual Spring meeting to Phoenix. I have never attended this event, as it is deeply academic, and has not been on my radar for 3D or advanced packaging technologies. However, after finding out from fellow SemiSisters, Rozalia Beica, Yole Developpement, and Nancy Stoffel, GE Global Reseach, that there was an advanced packagin... »

Page 2 of 212