Archives April 2016 - 3D InCites

What to Expect on 3D Integration and IoT at the 2016 Symposium on VLSI Technology

What to Expect on 3D Integration and IoT at the 2016 Symposium on VLSI Technology

If you’re planning to attend this year’s combined Symposium on VLSI Technology and Circuits, themed “Inflections for a Smart Society,” which takes place June 13-15, 2016 in Honolulu, HI, and you’re primarily interested in advancements in 3D integration and Internet of Things (IoT), here are some not-to-be-missed papers to put on your agenda. 3D Integration CEA Leti and STMicroelectronics... »

Convergence on the “Big Five”: Focus on Low-cost Flip Chip

Convergence on the “Big Five”: Focus on Low-cost Flip Chip

Part one of a five-part series.  Over the past few years, there has been a significant shift from PCs and notebooks to smartphones and tablets as drivers of advanced packaging innovation. In an industry segment that has grown accustomed to a multitude of package varieties, we believe we are now headed for convergence into what Amkor calls “The Big Five” advanced packaging platforms. These inc... »

Making MEMS Lemonade

Making MEMS Lemonade

In the USA, to motivate optimism when things haven’t turned out as expected, we say: “When life gives you lemons, make lemonade!” In other words, take the sour stuff, and find a way to make it sweet. In the MEMS business, we make lemonade all the time. Every fab engineer has experienced the horror of an important wafer emerging from a chamber cracked. It’s the last device ... »

Invensas Announces That Sandia National Laboratories Has Licensed ZiBond and DBI Technologies for Advanced 3D Semiconductor Applications

Invensas Announces That Sandia National Laboratories Has Licensed ZiBond and DBI Technologies for Advanced 3D Semiconductor Applications

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that Sandia National Laboratories signed a new license agreement for ZiBond® and Direct Bond Interconnect (DBI®) technologies. With this license Sandia will have access to the most advanced 3D integration technologies available, for use in a wide range of semiconductor applications. For... »

Extended Supply Chain Presents Exhibitors with New Opportunities at SEMICON West

Extended Supply Chain Presents Exhibitors with New Opportunities at SEMICON West

SAN JOSE, Calif. — April 18, 2016 — Leading innovators in today’s integrated electronics supply chain are preparing to showcase their products and services at SEMICON West 2016. Attendees will discover new international partners and suppliers, learn about the latest start-ups, and view cutting-edge, critical manufacturing technologies. The industry has seen dramatic changes since last year... »

Semiconductor Experts Chart Chip Industry’s Future Direction Beyond the “Moore’s Law” Horizon

Semiconductor Experts Chart Chip Industry’s Future Direction Beyond the “Moore’s Law” Horizon

HONOLULU, HI (APRIL 20, 2016) – Reflecting the semiconductor industry’s ongoing transition from a focus on geometric scaling to the integration of heterogeneous technologies that will enable the future “smart society,” the annual Symposia on VLSI Technology & Circuits has announced its 2016 program around the theme “Inflections for a Smart Society.” Uniquely positioned at the inter... »

FOGALE Nanotech Acquires Altatech: Expanded Portfolio Includes Wafer Inspection and Deposition Tools

FOGALE Nanotech Acquires Altatech: Expanded Portfolio Includes Wafer Inspection and Deposition Tools

Nimes, France, April 15, 2016 – FOGALE Nanotech today announced that it has acquired Altatech, a specialized technology leader in the development of wafer inspection and material deposition tools for semiconductor manufacturing. Altatech SAS has headquarters in Grenoble, France, located in the center of the French Silicon Valley with a commercial subsidiary in Germany. This strategic acquisition... »

3D Packaging Technologies for Power Electronics

3D Packaging Technologies for Power Electronics

There are a some upcoming events in the realm of power electronics that promise to be very interesting and thought provoking for those interested in 3D packaging. Some of the best and brightest minds in the area of 3D packaging (including power electronics 3D packaging technologies) will be present. 3DPEIM is focused on the three dimensional design requirements of integrated power electronics. Ot... »

Rudolph Adds High-speed 3D Metrology to the NSX Series for Advanced Packaging Process Control

Rudolph Adds High-speed 3D Metrology to the NSX Series for Advanced Packaging Process Control

Wilmington, Mass.—Rudolph Technologies, Inc. (NYSE: RTEC) is pleased to announce the availability of new, high-speed 3D metrology on its flagship NSX® Series, a highly-flexible inspection and measurement platform for process development and control of die-level interconnects. Already in use by multiple customers worldwide, the NSX Series with high-speed 3D metrology is capable of both high-vol... »

Start Your 2.5D HBM Design Today

Start Your 2.5D HBM Design Today

High-bandwidth memory (HBM) is a JEDEC-defined standard, dynamic random access memory (DRAM) technology that uses through-silicon vias (TSVs) to interconnect stacked DRAM die. In its first implementation, it is being integrated with a system-on-chip (SoC) logic die using 2.5D silicon interposer technology. In June 2015, AMD introduced its Fiji processor, the first HBM 2.5D design, which comprises ... »

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