Archives March 2016 - 3D InCites

Micro and Nano X-ray Tomography of 3D IC Stacks

Micro and Nano X-ray Tomography of 3D IC Stacks

Advanced packaging, and particularly 3D through silicon via (TSV) integration technologies and the resulting 3D-stacked products, challenge materials and process characterization. For 3D TSV stacking of wafers or dies, die-to-die interconnections like micro solder bumps (e.g. AgSn) and Cu pillars are used. The control of the TSV filling and micro-bump quality is a particular issue. In this present... »

Amkor Technology Takes Leadership Position  in Advanced System-in-Package Market

Amkor Technology Takes Leadership Position in Advanced System-in-Package Market

TEMPE, Ariz. – March 23, 2016 – Amkor Technology Inc. (Nasdaq: AMKR), a leading semiconductor packaging and test service provider, today announced it has shipped 700 million RF and front-end advanced system-in-package (SiP) modules for mobile device applications. This achievement establishes Amkor’s leadership in delivering low-cost, high-performance advanced SiP solutions. “Reaching this ... »

Cost Analysis of a Wet Etch TSV Reveal Process

Cost Analysis of a Wet Etch TSV Reveal Process

Through silicon via (TSV) technology is a key design element being incorporated into more and more advanced packaging designs today. TSVs offer distinct benefits in form factor and improved performance and can enable new, innovative designs not previously possible. To scale this valuable technology and spark industry adoption, there is a need to refine and optimize the TSV reveal process to reduce... »

EMIB, the 3D Technology Landscape, and other Keynote Moments from IMAPS DPC 2016

EMIB, the 3D Technology Landscape, and other Keynote Moments from IMAPS DPC 2016

This year’s keynote talks at the 2016 IMAPS Device Packaging Conference (DPC 2016) provided some new insight into a number of interesting areas of importance to the advanced packaging community. I already addressed Bill Chen’s talk, which focused on system-in-package (SiP) and introduced a 3D Fan-out SiP approach. Here, I’ll focus on the key take-aways from the other three keynote talks that... »

System-in-Package was the Big Story at IMAPS DPC 2016

System-in-Package was the Big Story at IMAPS DPC 2016

“The sum is greater than the whole of its parts.” ~ Aristotle (and Bill Chen) While the technology tracks offered the latest developments in interposer and 3D IC processes, fan-out, wafer-level packaging, flip chip, MEMs, sensors and more, System-in-package (SiP) was the big story of the 2016 MAPS Device Packaging Conference, which was held March 15-17, 2016 in Fountain Hills, AZ. Why? Because... »

22nd TSMC Symposium Conveys Accomplishments and Looks at the Road Ahead

22nd TSMC Symposium Conveys Accomplishments and Looks at the Road Ahead

Earlier this week I had the opportunity to attend this year’s TSMC Symposium. Just like in many previous years, TSMC had a lot of progress to report and demonstrated that they have a clear vision of the road ahead. As I expressed in previous years’ blogs, I started to get to know TSMC as a formidable competitor when I was marketing ASIC solutions at VLSI Technology. TSMC led the transition fro... »

2016 Illuminated:  Same Bulb, Different Shades?

2016 Illuminated: Same Bulb, Different Shades?

Collected impressions of 2016 to date: the unfortunate passing of too, too many favorite musicians; the hard-to-escape-from strident bellicosity of our national political campaigns; a winter of welcome, abundant, Northern California rains; along with a plethora of riches in the Silicon Valley conference, symposium, and seminar vein. Take the January 2016 Johnson School Dinner at the Rosewood Hotel... »

HBM Supply Chain Seminar Highlights System-level Advantages

HBM Supply Chain Seminar Highlights System-level Advantages

The Computer History Museum in Mountain View is a very impressive place to show you the enormous progress ICs and Electronic Systems have made in the most recent 50+ years. What I like even more is the fact that an increasing number of high-tech companies and industry organizations are utilizing this great facility for charting our future path on the innovation curve with exhibitions, seminars, wo... »

The HBM Supply Chain is Open for Business!

The HBM Supply Chain is Open for Business!

Last June, AMD made 3D integration history with its introduction of the Fiji gaming processor unit (GPU), which for the first time put high bandwidth memory (HBM) — a true 3D stack integrating memory die with through silicon via (TSVs) — into production. Fiji is a Si interposer-based module comprising an ASIC GPU surrounded by 4 HBM stacks, and it is powering AMD’s latest generation of Radeo... »

KLA-Tencor Corp. Receives Intel’s Preferred Quality Supplier Award

KLA-Tencor Corp. Receives Intel’s Preferred Quality Supplier Award

KLA-Tencor Corp. has been recognized as one of 26 companies receiving Intel Corporation’s Preferred Quality Supplier (PQS) award for their performance in 2015. KLA-Tencor Corp.has demonstrated industry-leading commitment across all critical focus areas on which they are measured: quality, cost, availability, technology, customer service, labor and ethics systems and environmental sustainability.... »

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