Archives February 2016 - 3D InCites

EV Group Technology Day Examines Photonics, Nanoimprint Lithography, 3D and MEMS

EV Group Technology Day Examines Photonics, Nanoimprint Lithography, 3D and MEMS

It’s been two years since I last visited EV Group headquarters in Schärding, Austria, so I was glad to be able attend EVG Technology Day on February 17, 2016 at the Fremont Marriott, in Fremont CA. It was a good reminder of the company’s many and varied capabilities in processes targeting 3D and MEMS, and I learned lots more about photonics and nano-imprint lithography (NIL). The first hal... »

Intercepting IC Products with a Disruptive Technology Option

Intercepting IC Products with a Disruptive Technology Option

Much has been written about the challenges that corporations face – especially established corporations – in adapting to a disruptive technology and the associated paradigm shifts. Most of the tomes on the subject focus on corporate management strategies. My intent is to discuss these challenges from a technology point of view – specifically when it comes to adopting so-called 2.5D and 3D d... »

Shifting Packaging Landscape brings Both Challenges and Growth

Shifting Packaging Landscape brings Both Challenges and Growth

2015 overall was a mixed year for the materials sector in the electronics market, with a general slowdown in PC-related segments offset by continued growth in mobile smart phones and other handheld devices despite industry growth flattening out late in 2015. In 2016, market forecasts indicate some improved growth and potential technology shifts. Looking at the 3D IC packaging market specifically, ... »

From the Ashes of Moore’s Law: More than Moore Has Arrived

From the Ashes of Moore’s Law: More than Moore Has Arrived

Now that the industry has finally called it a day for Moore’s law, will More than Moore be our guiding star for innovation? Analysts have been predicting the demise of Moore’s law for about as long as I have been covering 3D integration technologies. During that time, Intel has steadfastly refused to succumb to that sentiment, and has continued to pursue ways to continue CMOS scaling. That... »

Panel-level Packaging: the High Volume Manufacturing Roadmap has Yet to be Built

Panel-level Packaging: the High Volume Manufacturing Roadmap has Yet to be Built

Over the past few years, it becomes clear that some panel-level packaging choices will be more suitable than others for successful commercial development. So, when will the panel-level packaging industry take off? How will it evolve? “At Yole, we’ve identified five key packaging platforms that can be processed on a larger surface (rectangular/square),” asserts Amandine Pizzagalli, Technology... »

EV Group Joins IRT Nanoelec 3D Integration Program

EV Group Joins IRT Nanoelec 3D Integration Program

ST. FLORIAN, Austria – Feb. 5, 2016 – EV Group (EVG), an industry-leading supplier of wafer-bonding, lithography/nanoimprint lithography (NIL), metrology, photoresist coating, cleaning and inspection equipment, today announced its participation in the 3D integration consortium of IRT Nanoelec, which is headed by CEA-Leti. EVG joins Leti, STMicroelectronics and Mentor Graphics to develop advanc... »

Rudolph JetStep Lithography System Selected for  First Panel Fan-out Packaging Manufacturing Line

Rudolph JetStep Lithography System Selected for First Panel Fan-out Packaging Manufacturing Line

Flanders, New Jersey —Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading outsourced assembly and test facility (OSAT) has placed an order for the JetStep® Lithography System for the semiconductor advanced packaging industry’s first panel fan-out manufacturing line. The JetStep S Series Lithography System was selected after a thorough evaluation of competitive offerings, a... »

Presto Engineering Expands Turnkey IC Production Management Services with Three New Operations in Asia

Presto Engineering Expands Turnkey IC Production Management Services with Three New Operations in Asia

San Jose, Calif., USA – Presto Engineering Inc., a world leader in semiconductor product engineering and supply chain management, announced today that it has significantly expanded its turnkey IC production with the opening of two new manufacturing hubs and a world-wide logistics center in Asia. As an outcome of its partnership with Inside Secure, announced April 2015, Presto Engineering is tak... »

DesignCon 2016: Where the Chip meets the Board and Great Ideas Come to Life

DesignCon 2016: Where the Chip meets the Board and Great Ideas Come to Life

DesignCon 2016 at the Santa Clara Convention Center gave football fans among us an opportunity to watch the preparation work for Super Bowl 50. Right across the street from the Convention Center is Levi Stadium, where on Sunday, February 7, this year’s champion will be crowned. Impressive, but let’s not digress and focus on DesignCon. For me, in my role as business developer for innovative pro... »