Archives January 2016 - Page 2 of 2 - 3D InCites

Advanced Packaging Industry: What’s New on the Market?

Advanced Packaging Industry: What’s New on the Market?

The mobile sector is driving production and market growth; however a new market driver, the Internet of Things (IoT) is on the horizon and is expected to have a significant impact on the advanced packaging industry. “IoT-driven semiconductor industry consolidation is reflecting into a highly dynamic advanced packaging landscape,” says Andrej Ivankovic, Technology & Market Analyst, Advanc... »

2015 Retrospective and Outlook for 2016: 3D NAND Flash One-upmanship

2015 Retrospective and Outlook for 2016: 3D NAND Flash One-upmanship

“On average since 1885, the yearly height record has gone up by 10 feet (3 meters) each time. Since the 1960s the pace has picked up to 16 feet.” This is not 3D NAND Flash but skyscraper heights in a recent article in The Economist (the power of visual data presentation!). Similarly, 3D NAND height, as in the number of device layers, has become a metric for one-upmanship between the Flash man... »

A Metallization Technology Whose Time Has Come

A Metallization Technology Whose Time Has Come

2015 was a year marked by through silicon via (TSV) productization for three memory applications and a push for more MEMS and sensor technologies, as connectivity goes beyond computer-to-computer to thing-to-thing. For aveni, 2015 brought a new name, and leaps forward in commercializing our wet, molecular buildup process that provides a cost-effective alternative to conventional and costly metalli... »

A Perfect Storm is Brewing for Complex Packaging in 2016

A Perfect Storm is Brewing for Complex Packaging in 2016

If I had not attended the 2015 3D ASIP conference, my outlook for 2016 would have been less upbeat for complex packaging (2.5/3D). But this conference showed that companies and their development organizations are NOT solely looking towards FinFETS and sub 20nm silicon process nodes to meet their integration, power, speed, weight, etc metrics.   We are in the perfect storm: out of control costs a... »

Perspective 2016: A Word On Things, From Before There Was An Internet

Perspective 2016: A Word On Things, From Before There Was An Internet

You can’t have the perpetual motion machine I received for Christmas this year, at least until I patent it. And the candy’s mostly gone. But there is something I would like to share with you, readers, and that something is beginning-of-the-year thoughts about connected things. It is a heavy responsibility indeed to carry the load of being the ‘It” item at the Consumer Electronics Show, bec... »

Executive Viewpoint: Addressing IoT Security and Privacy Through Internet Protocol

Executive Viewpoint: Addressing IoT Security and Privacy Through Internet Protocol

In many of its implementations, the Internet of Things (IoT) certainly promises to improve our lives. But there are concerns about the potential trade-off: security breaches and relinquishment of privacy. While many are just realizing the implications, it’s been on the mind of Geoff Mulligan, executive director, IPSO Alliance, for quite some time. 3D InCites talked to Geoff about how the next p... »

Developing 3D Systems with Ultrafine and Dense Interconnections

Developing 3D Systems with Ultrafine and Dense Interconnections

For the past 2 to 3 years, 3D integration technology has developed into a technically and economically interesting road for further improving the performance of systems. In comparison to conventional planar 2D systems, we are now able to fabricate shorter and faster connections between circuits. And we can make these connections much denser, allowing a fine-grained partitioning of functions. Thes... »

3D ASIP 2015: 3D Manufacturing Processes from the Early Days to the Present

3D ASIP 2015: 3D Manufacturing Processes from the Early Days to the Present

For the first time since the 3D Architectures for Semiconductor Integration and Packaging (3DASIP) Conference was established, the organizing committee decided to acknowledge the work of two researchers who were instrumental in developing the core processes that enabled 3D TSV development. In a brief ceremony, Dr. Phil Garrou presented 3DIC Pioneer Awards to Professor Mitsumasa Koyanagi, Tohoku U... »

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